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Showing 1 to 12 of 12 for “"SiH4"”.

  1. Modeling and experimental process optimization for a SiH4 + H2 surface wave plasma discharge for silicon photovoltaics

    … excitation. The process gases used were silane (SiH4) and hydrogen (H2). The plasma source was shown to be advantageous in depositing films at very high deposition rate, exceeding 2 nm/s for nc-Si, while deposition of a-Si was observed at 10 nm/s and could be increased if a higher flowrate mass …

    uiuc Repository record for Modeling and experimental process optimization for a SiH4 + H2 surface wave plasma discharge for silicon photovoltaics (opens in a new tab)

  2. Fabrication and characterization of advanced ALGaN/GaN high-electron-mobility transistors

    … the development of in situ vacuum anneal and SiH4 or SiH4+NH3 passivation to realize high quality metal gate/high-k dielectric stacks on GaN surface using a multi-chamber metal-organic chemical vapor deposition (MOCVD) gate cluster tool. Chapter 3 demonstrates the realization of AlGaN/GaN …

    nus Repository record for Fabrication and characterization of advanced ALGaN/GaN high-electron-mobility transistors (opens in a new tab)

  3. In Situ Enrichment and Epitaxial Growth of 28Si Films via Ion Beam Deposition

    … starting from a natural abundance silane gas (SiH4) source. The Si is enriched in situ by mass separating the ions in a magnetic field just before deposition onto Si(100) substrates. Initial proof of principle experiments enriching 22Ne and 12C were also conducted. In the course of achieving …

    maryland Repository record for In Situ Enrichment and Epitaxial Growth of 28Si Films via Ion Beam Deposition (opens in a new tab)

  4. Optical Properties of Simple Molecules

    … excited states of tetrahedral molecules CH4 and SiH4, using two independent approaches. The results compare favorably both with the salient features of recent soft X-ray absorption experiments and with each other. Checks of the computational methods were made using neon and NH+4 as test cases. A …

    uiuc Repository record for Optical Properties of Simple Molecules (opens in a new tab)

  5. Chemical vapor deposition of thin films for ULSI interconnect metallization

    … for the growth of tantalum thin films using SiH4 reduction of TaF5. Using a temperature of 350„aC and reactant partial pressures of 0.2 Torr TaF5 and 0.3 Torr SiH4, we obtain a growth rate of 2.2 ¡Ó 1.7 nm/min. The XPS analysis results show that the Ta film is Si free, but contains relatively …

    lsu-thes Repository record for Chemical vapor deposition of thin films for ULSI interconnect metallization (opens in a new tab)

  6. Plasma Enhanced Layer-by-layer Deposition and Nano-crystallization of Si:H films

    … A capacitively-coupled plasma (CCP) with SiH4/He feed gas was used to deposit thin a-Si:H layers that were subsequently exposed to a H2 or D2 inductively-coupled plasma (ICP) to induce crystallization in the films. Deposition and nano-crystallization were performed sequentially and …

    houston Repository record for Plasma Enhanced Layer-by-layer Deposition and Nano-crystallization of Si:H films (opens in a new tab)

  7. Determination of the gas-flow patterns inside the hot-wire chemical vapor deposition system, using computational fluids dynamics software (fluent)

    … FLUENT. The mixture of two gases (Silane gas (SiH4) and Hydrogen gas (H2)) are delivered into the hot-wire chemical vapor deposition system (HWCVD) with the two deposited substrates (glass and Silicon). This process is performed by the solar cells group of the Physics department at the …

    western-cape Repository record for Determination of the gas-flow patterns inside the hot-wire chemical vapor deposition system, using computational fluids dynamics software (fluent) (opens in a new tab)

  8. Selective SiGe nanostructures

    … selective growth conditions in the SiH2Cl2/SiH4/GeH4/H2 system between 650-850⁰C, without the addition of C12 or HC1, on substrates patterned by both conventional and interferometric lithography. We have achieved several important milestones for the fabrication of vertical MOSFETs by …

    mit Repository record for Selective SiGe nanostructures (opens in a new tab)

  9. Understanding the molecular-level chemistry of H2O plasmas and the effects of surface modification and deposition on a selection of oxide substrates

    … from NH3 and NH3/O2 mixtures; SiH radicals in SiH4, SiH4/Ar, Si2H6 and Si2H6/Ar plasmas; and CH in plasmas formed from mixtures of CH4/Ar. These species were probed with both laser induced fluorescence (LIF) and OES. For the majority of the plasma species studied, θV are much higher than θR and …

    colostate Repository record for Understanding the molecular-level chemistry of H2O plasmas and the effects of surface modification and deposition on a selection of oxide substrates (opens in a new tab)

  10. High Growth Rate and High Purity Semi-Insulating Epitaxy Using Dichlorosilane For Power Devices

    … vapor deposition (CVD) of 4H-SiC using silane (SiH4) and light hydrocarbons e.g. propane (C3H8) or ethylene (C2H4) is the standard technology of growing epitaxial layers for any device applications. For high-voltage (>10 kV) devices made of SiC thick (>100 μm), low doped (~2x1014 cm-3) epilayers …

    south-carolina Repository record for High Growth Rate and High Purity Semi-Insulating Epitaxy Using Dichlorosilane For Power Devices (opens in a new tab)

  11. Structure/processing relationships in vapor-liquid-solid nanowire epitaxy

    … were found to be in good agreement with a SiH4 reaction model which associates decomposition to form SiH2 with higher nanowire growth rates. III-V nanowire growth on Si substrates was investigated as a possible route to the realization of high performance compound semiconductor devices on …

    mit Repository record for Structure/processing relationships in vapor-liquid-solid nanowire epitaxy (opens in a new tab)

  12. THE USE OF PECVD SILICON OXYNITRIDE THIN-FILMS IN MICROELECTRONICS MANUFACTURING

    … that has been developed in this project utilizes SiH4, N₂, N₂O and He as reactant gases to deposit silicon oxynitrides by plasma enhanced chemical vapor deposition (PECVD). Comparing with the conventional method using SiH₄ and N₂O as reactant gases, it provides a much wider range of film …

    nus Repository record for THE USE OF PECVD SILICON OXYNITRIDE THIN-FILMS IN MICROELECTRONICS MANUFACTURING (opens in a new tab)