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Showing 1 to 1 of 1 for “"Shorting probes"”.
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Design for pre-bond testability in 3D integrated circuits
… for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: …