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Showing 1 to 2 of 2 for “"Settore ING-IND/20 - Misure e Strumentazione Nucleari"”.

  1. Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC

    … extreme radiation hard properties, primarily owing to the geometrical advantages over planar sensors where electrodes are formed penetrating through the active substrate volume. Among them: reduction of the inter-electrode distance, lower depletion voltage requirement, inter-columnar high …

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  2. Development of enhanced double-sided 3D radiation sensors for pixel detector upgrades at HL-LHC

    … to be applied in the next generations of tracking devices that will be required to withstand extremely high radiation doses. In this sense, one of the most promising approaches to silicon detectors, is the so called 3D technology. This technology realizes columnar electrodes penetrating …

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