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Showing 1 to 4 of 4 for “"Ruthenium films"”.
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Investigation of the Effects of Solution Additives on Nucleation and Growth During Copper Electrodeposition Onto Resistive Ruthenium Barrier Layers
… solution additives on copper nucleation on ruthenium films. This investigation contributes procedures for quantitative characterization of the effect of additives on early stages of copper electrodeposition on ruthenium substrates. Such procedures will enable improved engineering methods for …
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Effect of Additives and Substrate Resistance on Shape Evolution During Electrodeposition: Nucleation, Growth and Trench Infill for Copper Interconnects
… nucleation and growth on resistive thin gold and ruthenium films was carried out in a electrochemical cell. A current pulse technique was found to produce a higher nucleation density that served to reduce the terminal effect and to result in more uniform deposit thickness and coalesce more rapid …
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Deposition and properties of Co- and Ru-based ultra-thin films
… both the liner layer(s) and the capping layer. Ruthenium has previously been considered as a material that could function as a single material liner, however its poor ability to prevent copper diffusion makes it incompatible with liner requirements. A recently described chemical vapor deposition …
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Growth and characterization of Ru films deposited by chemical vapor deposition : towards enhanced nucleation and film properties
… need to deposit ultra-thin, smooth, continuous films for use in applications such as the liner in back end processing. The liner must have good adhesion to both Cu and the dielectric, act as a Cu diffusion barrier, and be conductive enough to allow the electroplating of Cu. Ruthenium (Ru) has …