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Showing 1 to 2 of 2 for “"Relamination"”.

  1. Dimensional Stability of Multilayer Circuit Boards

    … the deformation and residual stress state due to relamination. Experimental values of the substrate stress relaxation modulus and coefficients of thermal expansion (CTE) are used as inputs in the numerical procedure to predict warpage of model circuit boards with a non-symmetric lay-up of 7628 …

    uiuc Repository record for Dimensional Stability of Multilayer Circuit Boards (opens in a new tab)