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Showing 1 to 4 of 4 for “"REFLOWING"”.
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ΜΕΛΕΤΗ ΔΙΑΧΥΤΙΚΗΣ ΑΝΑΠΤΥΞΗΣ ΤΗΣ ΔΙΑΜΕΤΑΛΛΙΚΗΣ ΦΑΣΗΣ FESN2 ΣΕ ΗΛΕΚΤΡΟΛΥΤΙΚΗ ΕΠΙΚΑΣΣΙΤΕΡΩΣΗ
… CLEANING, THE ELECTRODEPOSITION AND THE REFLOWING TEMPERATURE. CALCULATION OF THE REACTION TIME BETWEEN FE AND SN GIVES THE POSSIBILITY TO ANTICIPATETHE ALLOY THICKNESS. THIS RESULTS IN A REDUCTION OF THE ENERGY CONSUMPTION BY, AT LEAST 10% IN COMPARING WITH THE CONVENTIONAL CONTROL OF …
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Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
… printing, low-temperature sintering, solder reflowing, epoxy curing, sputtering deposition, electroplating, and patterning of direct-bond copper (DBC) were tightly controlled to ensure high-quality packaging with improved performance. Finally, the planar packaging of the high temperature …
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Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
… is compatible with the temperature of solder reflowing. The measured properties including electrical conductivity, thermal conductivity, interfacial thermal resistance, and the shear strength of sintered silver joints, are significantly better than those of the reflowed solder layer. Given …
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Electrical and Thermal Characterizations of IGBT Module with Pressure-Free Large-Area Sintered Joints
… was around 260oC, whereas 270oC for vacuum reflowing of solder, and 280oC under three MPa for pressure-sintering of silver. The process for wire bonding, lead-frame attachment, and thermocouple attachment are also recorded. Modules with the above three kinds of joints were first …