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Showing 1 to 6 of 6 for “"Pulse plating"”.

  1. Control of electrodeposit properties of nickel and nickel alloy by pulse plating.

    Pulsed-current electrolysis with various ratios of on-time to off-time have been applied to the deposition of Ni and Ni/Fe alloys from Watts and Ni/Fe baths.The electro-depositions of nickel and nickel-iron alloy on copper and mild-steel substrates using Watts and Ni/Fe baths have been …

    sheffield-hallam Repository record for Control of electrodeposit properties of nickel and nickel alloy by pulse plating. (opens in a new tab)

  2. Electrodeposition of FeCoNiCu quaternary system

    … multilayers were successfully fabricated with pulse plating and GMR value was reported for this electrodeposited system for the first time. A value of -6 % was achieved on rotating disk electrode (RDE) and this maximum occurred when the structure had no preferred crystal phase. Over 40% GMR has …

    lsu-thes Repository record for Electrodeposition of FeCoNiCu quaternary system (opens in a new tab)

  3. Investigation on the Mechanism of Electrocodeposition and the Structure-Properties Correlation of Nickel Nanocomposites

    … the electrocodeposition (ECD) process from metal plating baths containing dispersed nanoparticles. By using this technique, a broad range of substrate sizes and shapes can be coated cost-effectively. However, the prediction of the amount as well the distribution of nanoparticles within the metal …

    qucosa-diss

  4. Electrodeposition of nickel-copper alloys and nickel-copper-alumina nanocomposites into deep recesses for MEMS

    Electrodeposition is an important component in the fabrication of micro electro mechanical systems (MEMS). Nickel is the most commonly used material to produce three dimensional microstructures and few material alternatives have been demonstrated. In this dissertation, electrodeposited Ni-Cu alloys …

    lsu-thes Repository record for Electrodeposition of nickel-copper alloys and nickel-copper-alumina nanocomposites into deep recesses for MEMS (opens in a new tab)

  5. Copper and Copper Alloys: Studies of Additives

    … to improve the process of copper electroplating and extend copper technology to meet the challenges of future device dimensions. The improvement in the plating process of copper is being sought by the integration of an iron redox couple (Fe3+/Fe2+) to copper electrolytes. Certain benefits …

    columbia-diss Repository record for Copper and Copper Alloys: Studies of Additives (opens in a new tab)

  6. The effect of mass transport on deposit quality in copper electrowinning

    … cell while still producing smooth deposits. Pulsed plating with three rectangular waveforms was also examined A pulse-rest waveform with a 50% duty cycle gave a finer deposit morphology. Pulse-reverse and pulse-rest-reverse waveforms were also used but were inferior to the pulse-rest …

    must-thes Repository record for The effect of mass transport on deposit quality in copper electrowinning (opens in a new tab)