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Showing 1 to 20 of 37 for “"Printed Circuit Boards (PCBs)"”.

  1. Developing Highly Accelerated Life Test (HALT) method to improve product robustness and shorten development cycle

    … used to identify the latent defects for the printed circuit boards (PCBs) during the early stage of the product development process. The inconsistency in executing HALT may not reveal the maximum amount of design weaknesses or intermittent failures, which would eventually lead to the …

    mit Repository record for Developing Highly Accelerated Life Test (HALT) method to improve product robustness and shorten development cycle (opens in a new tab)

  2. Development of three-dimensional passive components for power electronics

    As component and power densities have increased, printed circuit boards (PCBs) have taken on additional functionality including heatsinking and forming constituent parts of electrical components. PCBs are not well suited to these tasks. A novel fabrication method is proposed to develop an enhanced …

    mit Repository record for Development of three-dimensional passive components for power electronics (opens in a new tab)

  3. Numerical analysis of surface mount electronics with viscoelastic epoxy underfills and potting

    … modern electronics industry. In some instances, printed circuit boards (PCBs) have been encapsulated in foam or epoxy to improve survivability. When packaging PCBs to survive operational environments, it is important to understand the stresses and strains generated during manufacturing and …

    unm Repository record for Numerical analysis of surface mount electronics with viscoelastic epoxy underfills and potting (opens in a new tab)

  4. Reliability evaluation of stacked die BGA assemblies under mechanical bending loads

    … were four die stacked BGAs assembled on printed circuit boards (PCBs) with eutectic tin-lead solder and gold over nickel finishes, both as-reflowed and after aging. The failure envelopes of both types of specimen were quantified in terms of PCB flexural strain and strain rate. The …

    maryland Repository record for Reliability evaluation of stacked die BGA assemblies under mechanical bending loads (opens in a new tab)

  5. Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-free Soldering Conditions

    The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher temperature exposures during assembly compared with traditional eutectic Sn/Pb solders. The knowledge of possible variations in the PCB laminate material properties due …

    maryland Repository record for Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-free Soldering Conditions (opens in a new tab)

  6. Design of an improved electronics platform for the EyeRing wearable device

    … A more custom platform, consisting of two printed circuit boards (PCBs), peripherals, and firmware, was designed to make the device more usable and functional. Firmware was developed to ameliorate the communication capabilities, microcontroller functionality, and system power use. Improved …

    mit Repository record for Design of an improved electronics platform for the EyeRing wearable device (opens in a new tab)

  7. Minimizing machine set-up time when manufacturing printed circuit boards.

    … placement machines for the production of Printed Circuit Boards (PCBs). However, when these fast machines have to assemble small volumes of many different types of circuit boards, the machine set-up time becomes much more important than the assembly rate of each board. In order to minimize …

    ottawa-retro Repository record for Minimizing machine set-up time when manufacturing printed circuit boards. (opens in a new tab)

  8. EMI failure analysis techniques and noise prediction for trace crossing split planes

    … the advantages and limitations of each method. Printed circuit boards (PCBs) often have high speed data traces crossing splits in the adjacent reference planes due to space limitations and cost constraints. These split planes usually result from different power islands on nearby layers. The …

    must-thes Repository record for EMI failure analysis techniques and noise prediction for trace crossing split planes (opens in a new tab)

  9. A Comparative Analysis of Experimental and Computational Methods for Evaluating Partial Discharge Inception Voltage on Printed Circuit Boards

    … in the literature pertains to the design of printed circuit boards (PCBs) for these voltage levels. This thesis investigates the likelihood of PD behavior in HV PCBs and evaluates the suitability of existing design guidance for avoiding this behavior in the implementation of HV PCBs. As part …

    alabama Repository record for A Comparative Analysis of Experimental and Computational Methods for Evaluating Partial Discharge Inception Voltage on Printed Circuit Boards (opens in a new tab)

  10. Clustering Algorithms for Component Placement in Printed Circuit Boards

    In 2024, approximately 12 billion printed circuit boards (PCBs) were manufactured globally [1], with the trend increasing gradually, and the majority of PCB layouts still being completed manually. The manual design process amounts to millions of hours of tedium that can be eased with automation. …

    mit Repository record for Clustering Algorithms for Component Placement in Printed Circuit Boards (opens in a new tab)

  11. Economic and environmental opportunities in electronics industry

    … the situation by characterizing metals within printed circuit boards (PCBs). My work focuses on the evolving composition and the flow of materials located outside of PCBs. I have discovered significant economic potential of non-PCB metals, and provide suggestions for optimization of different …

    mit Repository record for Economic and environmental opportunities in electronics industry (opens in a new tab)

  12. Nonlinear Polymer Nanocomposite for Field Grading in Medium-Voltage Power Converters under High-Altitude and Humid Environments

    … (MV) power modules and suppress flashover on printed-circuit boards (PCBs) at high altitudes. Electric field simulations of the triple-point (TP) region revealed strong E-field intensification at conductor-ceramic-silicone and conductor-FR4-air interfaces, leading to premature partial …

    vt Repository record for Nonlinear Polymer Nanocomposite for Field Grading in Medium-Voltage Power Converters under High-Altitude and Humid Environments (opens in a new tab)

  13. PCB-Based 1.2 kV SiC MOSFET Packages for High Power Density Electric Vehicle On-Board Chargers

    … packaging technologies is the use of printed circuit boards (PCBs) because the technology is mature—resulting in low costs—and the allowable stackups are ideal for integrating driving circuitry and power loop components—resulting in reduced manufacturing complexity. This thesis …

    vt Repository record for PCB-Based 1.2 kV SiC MOSFET Packages for High Power Density Electric Vehicle On-Board Chargers (opens in a new tab)

  14. Sustainable methodologies to transform non-metallic printed circuit boards waste into value-added products

    … be adopted to substantially recycle the e-waste. Printed circuit boards (PCBs) is prevalent in almost all of the electronic components and it is majorly categorised into FR-2 (single/double sided PCBs) and FR-4 (multi-layered PCBs). The substrates in FR-2 types are composed of phenol formaldehyde …

    unsw Repository record for Sustainable methodologies to transform non-metallic printed circuit boards waste into value-added products (opens in a new tab)

  15. Precision connector assembly automation

    … and high-performance computers contain several printed circuit boards (PCBs) that are mounted in card-cage assemblies. Level-3 connectors, often called board-to-board connectors, transmit signals between the primary backplane PCB and the daughter card PCBs. These connectors are customized for …

    mit Repository record for Precision connector assembly automation (opens in a new tab)

  16. Selective thermal transformation of e-waste to novel metallic alloys

    … a new innovative solution for transforming Printed Circuit Boards (PCBs) into value-added materials. As the main approach to achieve this gaol, this thesis investigates, verifies and determines the optimal parameters for the selective thermal transformation of problematic PCBs which is one …

    unsw Repository record for Selective thermal transformation of e-waste to novel metallic alloys (opens in a new tab)

  17. Predicting solder defects in printed circuit board assembly (PCBA) process

    Printed circuit boards (PCBs) are core components of virtually every modern electronic device, from smartphones to servers. Accordingly, printed circuit board assembly (PCBA) has become core to Flex, a leading electronics manufacturing services (EMS) company. As the EMS industry continues to …

    mit Repository record for Predicting solder defects in printed circuit board assembly (PCBA) process (opens in a new tab)

  18. Standard operating procedure for Highly Accelerated Life Testing (HALT) : design and standardization of fixture setup for circuit boards

    … as part of a reliability improvement process for printed circuit boards (PCBs). More specifically, the thesis focuses on drafting a standard operating procedure (SOP) to standardize the fixture setup process so as to minimize variation in vibrational responses attributed to fixture setup. This …

    mit Repository record for Standard operating procedure for Highly Accelerated Life Testing (HALT) : design and standardization of fixture setup for circuit boards (opens in a new tab)

  19. RECYCLING OF PRECIOUS METALS FROM WASTE PRINTED CIRCUIT BOARDS VIA A COMBINATION OF PYRO AND HYDROMETALLURGICAL PROCESSES

    … development of innovative recycling techniques. Printed Circuit Boards (PCBs) are among the most complex components of e-waste, consisting of a diverse mix of metals, polymers, and ceramics. Recycling PCBs is crucial for managing hazardous waste and recovering valuable materials, as they contain …

    unsw Repository record for RECYCLING OF PRECIOUS METALS FROM WASTE PRINTED CIRCUIT BOARDS VIA A COMBINATION OF PYRO AND HYDROMETALLURGICAL PROCESSES (opens in a new tab)

  20. Investigating ferric ion production and consumption trends in a simulated e-waste bioleaching environment for maximum metal dissolution efficiency

    … metals making their recovery beneficial. Printed circuit boards (PCBs) are an essential part of WEEE. Although WEEE forms a small part of the waste stream (3 %), it contains a high concentration of metals. As such, PCBs form the focus of this study. Base metals, especially copper, hamper …

    cape-town Repository record for Investigating ferric ion production and consumption trends in a simulated e-waste bioleaching environment for maximum metal dissolution efficiency (opens in a new tab)

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