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Showing 1 to 20 of 185 for “"Printed Circuit Board"”.

  1. Printed Circuit Board Design for Frequency Disturbance Recorder

    … will physically fit all the components on one Printed Circuit Board (PCB). At the same time, the software that is to be implemented on the new board is to be kept similar if not the same as that of the current design. The current FDR uses the Axiom CME555 development board and it is interfaced …

    vt Repository record for Printed Circuit Board Design for Frequency Disturbance Recorder (opens in a new tab)

  2. Cost and quality drivers in printed circuit board assembly

    Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1992 and (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1992.

    mit Repository record for Cost and quality drivers in printed circuit board assembly (opens in a new tab)

  3. Physical modeling of electrical conduction in printed circuit board insulation

    … confidence of their validity. As a first case,printed circuit board (PCB) insulation was selected as a target for investigation. With an increase in the electronics and circuit miniaturization coupled with an increase in voltage in 42 volt as well as hybrid vehicles, PCB reliability has become …

    mit Repository record for Physical modeling of electrical conduction in printed circuit board insulation (opens in a new tab)

  4. Predicting solder defects in printed circuit board assembly (PCBA) process

    Printed circuit boards (PCBs) are core components of virtually every modern electronic device, from smartphones to servers. Accordingly, printed circuit board assembly (PCBA) has become core to Flex, a leading electronics manufacturing services (EMS) company. As the EMS industry continues to …

    mit Repository record for Predicting solder defects in printed circuit board assembly (PCBA) process (opens in a new tab)

  5. Implementation of remote monitoring system in printed circuit board assembly equipment

    … the addition of the monitoring capability. The printed circuit board assembly area of the North Penn Electronics Facility was selected as the target of this study. A system to monitor the component pick performance of the individual feeders on the surface mount pick and place machines was …

    mit Repository record for Implementation of remote monitoring system in printed circuit board assembly equipment (opens in a new tab)

  6. Design method of a modular electronic printed circuit board testing system

    The failure rate of the printed circuit board electronic testing process is higher than acceptable at a Lenze Americas factory. This thesis will understand the root causes of failure, and use system engineering methods to decide what course of action should be taken. A Tradespace analysis is used …

    mit Repository record for Design method of a modular electronic printed circuit board testing system (opens in a new tab)

  7. Design influences on manufacturing flexibility in the printed circuit board industry

    Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1992.

    mit Repository record for Design influences on manufacturing flexibility in the printed circuit board industry (opens in a new tab)

  8. A description and simulation of a printed-circuit board manufacturing plant

    Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1988.

    mit Repository record for A description and simulation of a printed-circuit board manufacturing plant (opens in a new tab)

  9. The printed circuit board assembly and test operation : toward a better process

    Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1983.

    mit Repository record for The printed circuit board assembly and test operation : toward a better process (opens in a new tab)

  10. Printed circuit board materials : an evaluation of manufacturing technologies and market requirements

    Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1990.

    mit Repository record for Printed circuit board materials : an evaluation of manufacturing technologies and market requirements (opens in a new tab)

  11. Sequencing rules for manufacturing flowshops with an application to printed circuit board assembly

    Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1991.

    mit Repository record for Sequencing rules for manufacturing flowshops with an application to printed circuit board assembly (opens in a new tab)

  12. An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

    … results are also presented demonstrating how board assemblers can use the developed technique to optimize the process for their set-ups and to establish the feasibility as well as effectiveness of the overall heuristic and comparing various strategies used in the design of the heuristic. We …

    uiuc Repository record for An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization (opens in a new tab)

  13. Decision Support System to Predict the Manufacturing Yield of Printed Circuit Board Assembly Lines

    … on developing a model to predict the yield of a printed circuit board manufactured on a given assembly line. Based on an extensive literature review as well as discussion with industrial partners, it was determined that there is no tool available for assisting engineers in determining reliable …

    vt Repository record for Decision Support System to Predict the Manufacturing Yield of Printed Circuit Board Assembly Lines (opens in a new tab)

  14. Hydrothermal Processing of Barium Strontium Titanate Composites on Printed Circuit Board for Thin Film Varactor Applications

    Thin film Ba0.7Sr0.3TiO3 has been deposited onto printed circuit boards at low temperatures for low and high frequency applications. The fabrication method involves spin coating sol-gel composites (a mixture of BST powder suspended in an amorphous BST sol), and treating the resultant films at …

    queens Repository record for Hydrothermal Processing of Barium Strontium Titanate Composites on Printed Circuit Board for Thin Film Varactor Applications (opens in a new tab)

  15. Design of a Printed Circuit Board for a Sensorless Three-Phase Brushless DC Motor Control System

    … controller which is often in the form of a printed circuit board. As such, the size and performance capability of the controller can restrict the performance of the overall motor control system so advancements of these controllers further the potential use of BLDC motors. This project …

    calpoly Repository record for Design of a Printed Circuit Board for a Sensorless Three-Phase Brushless DC Motor Control System (opens in a new tab)

  16. Developing a methodology to link printed circuit board assembly yield targets to commodity group quality goals

    … and PCBA Yield is measured as the percentage of boards which meet Cisco's Six Sigma yield targets. The proof of concept for such an analytical link shows that these two metrics can be analytically related, and furthermore can be used to ensure that the effort expended to improve DPPM is optimally …

    mit Repository record for Developing a methodology to link printed circuit board assembly yield targets to commodity group quality goals (opens in a new tab)

  17. The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board

    … In this work, three different types of Printed Circuit Board (PCB) designs are studied. The PCBs are less costly and can be easily protected from the impact of the electromagnetic environment from the EM radiation. The effect of two high radiation circuits on each other has been studied …

    uthm Repository record for The effect of shielding, grounding and bonding to the electromagnetic compatibility of high emission printed circuit board (opens in a new tab)

  18. Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-free Soldering Conditions

    The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher temperature exposures during assembly compared with traditional eutectic Sn/Pb solders. The knowledge of possible variations in the PCB laminate material properties due …

    maryland Repository record for Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-free Soldering Conditions (opens in a new tab)

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