Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 47 for “"Power module"”.
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Innovative Semiconductor Package Technology for Power Module Applications
L'abstract è presente nell'allegato / the abstract is in the attachment
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Power Module with Series-connected MOSFETs in Flip-chip Configuration
Power module design is needed for high system performance and reliability, especially in terms of high efficiency and high power density. Low parasitic impedance and thermal management is desired for the lower power loss and device stress. For power module with high efficiency and improved …
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Thermal and Electrical Parasitic Modeling for Multi-Chip Power Module Layout Synthesis
… approaches for layout synthesis of Multi-Chip Power Modules (MCPMs). MCPMs integrate power semiconductor devices and drive electronics into a single package. As the switching frequency of power devices increases, the size of the passive components are greatly reduced leading to gains in …
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Design and Development of High Density High Temperature Power Module with Cooling System
In recent years, the SiC power semiconductor has emerged as an attractive alternative that pushes the limitations of junction temperature, power rating, and switching frequency of Si devices. These advanced properties will lead converters to higher power density. However, the reliability of the SiC …
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Smart Power Module for Distributed Sensor Power Network of an Unmanned Ground Vehicle
… in modern electronic design particularly in power conversion where conversion losses directly set the upper limit of system efficiency. A wide variety of commercially available DC-DC conversion elements have inefficiencies in the 90-97% range. The efficiency range of most common …
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Integrated Current Sensor using Giant Magneto Resistive (GMR) Field Detector for Planar Power Module
Conventional wire bond power modules have limited application for high-current operation, mainly because of their poor thermal management capability. Planar power modules have excellent thermal management capability and lower parasitic inductance, which means that the planar packaging method is …
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Analysis of Direct-Soldered Power Module / Heat Sink Thermal Interface for Electric Vehicle Applications
Reducing the thermal impedance between power module and heat sink is important for high-power density, low-cost inverter applications. Mounting a power module by directly soldering it onto a heat sink can significantly reduce the thermal impedance at the module / heat sink interface, as compared to …
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A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer
… a novel three-dimensional (3-D) wire bondless power module package for silicon carbide (SiC) power devices to achieve a low parasitic inductance and an improved thermal performance. A half-bridge module consisting of 900-V SiC MOSFETs is realized to minimize stray parasitic inductance as well …
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Evaluation and Analysis on the Effect of Power Module Architecture on Common Mode Electromagnetic Interference
… devices are becoming increasing popular in power electronics applications. However, WBG semiconductor devices generate a substantial amount of conducted electromagnetic interference (EMI) compared to silicon (Si) devices due to their ability to operate at higher switching frequencies, higher …
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A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module
… co-fired ceramic (LTCC) interposer-based module-level 3-D wire bondless stacked power module. As part of the dissertation work, the 3-D wire bondless stack is designed, simulated, fabricated and characterized. The 3-D wire bondless stack is realized with two stand-alone power modules in a …
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Electrical Breakdown of Thermal Spray Alumina Ceramic Applied to AlSiC Baseplates Used in Power Module Packaging
… new alternatives in the production of electronic power modules that use alumina ceramic as an isolation layer. Current processes use direct bond copper (DBC) soldered to a nickel plated copper heat spreader. A coefficient of thermal expansion (CTE) mismatch exists between copper and alumina and …
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Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module
… of a 1.2 kV, 6.5 mΩ, half-bridge, SiC MOSFET power module to evaluate the impact of parametric device tolerances on electrical and thermal performance. Paralleling power devices increases current handling capability for the same bus voltage. However, inherent parametric differences among dies …
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Bayesian Optimization of PCB-Embedded Electric-Field Grading Geometries for a 10 kV SiC MOSFET Power Module
… 10 kV bondwire-less silicon-carbide (SiC) MOSFET power module. Due to the ultra-high-density of the power module, careful design of field-grading structures inside the bus bar is required to mitigate the high electric field strength in the air. Using Bayesian optimization and a new weighted …
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Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress
This study focuses on development a planar power module with low thermal impedance and thermo-mechanical stress for high density integration of power electronics systems. With the development semiconductor technology, the heat flux generated in power device keeps increasing. As a result, more and …
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Electro-Thermal Device-Package Co-Design for a High-Temperature Ultra-Wide-Bandgap Gallium-Oxide Power Module
Power electronic systems and components that can operate in environments with ambient temperatures exceeding 250 °C are needed for innovation in automotive, aerospace, and down-hole applications. With the imminent mass electrification of transportation and industry, the high-temperature electronics …
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Design and Validation of a High-Density 10 kV Silicon Carbide MOSFET Power Module with Reduced Electric Field Strength and Integrated Common-Mode Screen
… and usage trends are changing. Hence, the power electronics that control the flow and conversion of electrical energy are an important research area. Advanced power electronics with improved efficiency, power density, reliability, and functionality are critical in data center, …
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Electrical Design Considerations and Packaging of Power Electronic Modules
<p>A modern power electronic module can save significant energy usage in the power electronic systems by improving their switching efficiencies. One way to improve the efficiency of the power electronic module is to reduce its parasitic circuit elements. The purpose of this thesis is to investigate …
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Control and Operation of a Microgrid Involving a PEM Fuel Cell Through Analysis and Experimentation
… proton exchange membrane fuel cell (PEMFC) power module and two synchronous generators operating in an islanded mode. The work includes the experimental investigation of the dynamic characteristics of the distributed generators in this prototype microgrid. A control and operation system is …
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Packaging and Magnetic Integration for Reliable Switching of Paralleled SiC MOSFETs
… effectiveness and manufacturability. For a SiC power module with current rating higher than 100 A, high did/dt and dvds/dt could possibly cause cross-turn-on (crosstalk-induced turn-on) through the gate-to-drain capacitance Cgd of the MOSFET dies and the package inductances. Mismatches in …
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Design and Optimization of a High Power Density Silicon Carbide Traction Inverter
… silicon carbide based 150-kW 25 kW/L DC-AC power conversion unit capable of operation with coolant temperatures up to 90°C. The project goals were met and exceeded by first analyzing the established inverter topologies to find which one would yield the highest power density while still …
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