Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 7 of 7 for “"Power Packaging"”.
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Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Technology
Power electronics is a constantly growing and demanding technical field. Consumer demand and developing technologies have made the improvement of power density a primary emphasis of research for this area. Power semiconductors present some of the major challenges for increasing system level power …
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Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules
… need for the introduction of high reliability power electronics in converting the raw form of electricity into efficient electricity for these applications is uprising. One of the most common failures in power electronics is temperature related failure such as overheating. To address the issue …
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The Development of Novel Interconnection Technologies for 3D Packaging of Wire Bondless Silicon Carbide Power Modules
… dissertation advances the cause for the 3D packaging and integration of silicon carbide power modules. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power …
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Design and Analyses of a Dimple Array Interconnect Technique for Power Electronics Packaging
… thermal and mechanical characteristics for power electronics applications. In the DAI structure, electrical connections onto the devices are achieved by solder bumps formed between the silicon device and arrays of dimples stamped on a metal sheet flex. This research first presents the design …
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Thermal and Thermo-Mechanical Analyses of Wire Bond vs. Three-dimensionally Packaged Power Electronics Modules
… more reliably realizing energy conversion in the power electronics industry is pushing the limits of current wire bonding packaging technology. Emerging three-dimensional power packaging techniques have shown their potential to replace wire bonding technology down the road. However, these …
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Electrical Breakdown of Thermal Spray Alumina Ceramic Applied to AlSiC Baseplates Used in Power Module Packaging
… new alternatives in the production of electronic power modules that use alumina ceramic as an isolation layer. Current processes use direct bond copper (DBC) soldered to a nickel plated copper heat spreader. A coefficient of thermal expansion (CTE) mismatch exists between copper and alumina and …
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Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
… is one of the most important processes in the packaging of power semiconductor devices. The current die-attach materials/techniques, including conductive adhesives and reflowed solders, can not meet the advance of power conversation application. Silver paste sintering has been widely used in …