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Showing 1 to 1 of 1 for “"Power Module Thermal Analysis"”.
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Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules
<p>This thesis research investigates thermal performance, parasitic extraction and wirebond/encapsulation reliability of power electronic modules. Thermal performance is critical to the power electronic modules. As such, thermal analysis is an important part of the power electronic module design …