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Showing 1 to 1 of 1 for “"Piezoresistivität"”.

  1. Frei applizierbare MOSFET-Sensorfolie zur Dehnungsmessung

    While the integration of semiconductor circuits continues to rise on a fairly high level, the same is not the case regarding package integration. One means of enhancing package integration is using foldable chips. The main requirement for using foldable chips is to manufacture fracture resistent …

    aachen Repository record for Frei applizierbare MOSFET-Sensorfolie zur Dehnungsmessung (opens in a new tab)