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Showing 1 to 3 of 3 for “"PCB integration"”.
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Thermal and Electrical Considerations for the Design of Highly-Integrated Point-of-Load Converters
… and smaller footprint and profile requires integration and higher switching frequencies in order to continue. Higher frequencies require physical integration to eliminate problems induced by parasitics, which increase losses. GE's Power Overlay and Philip's PCB integration schemes have been …
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p-GaN Platform for Next-Generation GaN Complementary Transistors and Circuits
… discrete transistors or printed circuit board (PCB) integration. The p-GaN platform exhibits tremendous potential in power ICs and recently, in high temperature (500 °C) digital circuits. While the initial demonstrations offer promising results, several challenges remain. Notably, the lack of a …
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High Frequency GaN Characterization and Design Considerations
The future power conversion system not only must meet the characteristics demanded by the load, but also have to achieve high power density with high efficiency, high ambient temperature, and high reliability. Density and efficiency are two key drivers and metrics for the advancement of power …