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Showing 1 to 4 of 4 for “"Nanosilver paste"”.
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Processing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste
… role in the total packaging process. Sintered nanosilver paste may be used as a lead-free alternative to solder for die-attachment at sintering temperature below 300 °C without applying any pressure. Typically, the substrate, such as direct bond copper (DBC) substrates, has surface …
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A diffusion-viscous analysis and experimental verification of the drying behavior in nanosilver-enabled low-temperature joining technique
… die-attach material used with LTJT is a silver paste consisting of silver powder (micron- or nano-size particles) mixed in organic solvent and binder formulation. It is believed that the drying of the paste during the bonding process plays a critical role in determining the quality of the …
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Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability
… performance of the power electronics packages. Nanosilver sintering has becoming an emerging solder-free, environmental friendly die-attach technology. Researchers have demonstrated the feasibility of die-attachment on silver (Ag) or gold (Au) surfaces by pressure-less or low-pressure (< 5 MPa) …
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Design Methodology and Materials for Additive Manufacturing of Magnetic Components
… several magnetic-filled-benzocyclobutene (BCB) pastes curable below 250 degree C were formulated for a commercial multi-material extrusion-based 3D-printer to form the core part. Two magnetic fillers were used: round-shaped particles of permalloy, and flake-shaped particles of Metglas 2750M. To …