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Showing 1 to 3 of 3 for “"Nanoscale silver paste"”.
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Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection
… relationships of low-temperature sintering of nanoscale silver pastes. The nanoscale silver pastes have been formulated by adding organic components (dispersant, binder and thinner) into nano-silver particles. The selected organic components have the nano-particle polymeric stabilization, paste …
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Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
… low-temperature sintering technique enabled by a nanoscale silver paste was developed for attaching large-area (>100 mm2) semiconductor chips. The nanoscale silver paste can be sintered at a much lower temperature (<300 oC) than in the conventional sintering process (>800 oC), and at the same time …
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Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
… the advance of power conversation application. Silver paste sintering has been widely used in microelectronics and been demonstrated the superior properties. The high processing temperature, however, prevents its application of interconnecting power semiconductor devices. This research focuses …