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Showing 1 to 4 of 4 for “"Nano diamond"”.

  1. Diamond seeding process for the heterogenous integration of high quality diamond on semiconductors

    Diamond thin films grown by chemical vapor deposition (CVD) have a wide band gap, high hardness, chemical inertness, and high thermal conductivity, making them an attractive material for a wide range of applications. Due to high surface energy and low sticking probability of diamond, it is …

    tdl Repository record for Diamond seeding process for the heterogenous integration of high quality diamond on semiconductors (opens in a new tab)

  2. DEVELOPMENT OF COST EFFECTIVE NANOSTRUCTURAL REINFORCEMENTS FOR ADVANCED COMPOSITES

    … composites reinforced with complex carbon nanostructures for multiple applications. The main process in this study is mechanical milling which induce the in-situ transformation of carbon in the form of soot into complex nanostructures that behave as effective reinforcements. The soot mainly …

    houston Repository record for DEVELOPMENT OF COST EFFECTIVE NANOSTRUCTURAL REINFORCEMENTS FOR ADVANCED COMPOSITES (opens in a new tab)

  3. Nanocarbons as charge carriers in organic solar cells

    … additives, and tandem cell architecture. Nanocarbons possess unique physical and chemical properties that can contribute to the enhancement of OPV performance, such as charge carrier mobility, thermal conductivity, mechanical strength, increased optical absorption and solubility in organic …

    njit Repository record for Nanocarbons as charge carriers in organic solar cells (opens in a new tab)

  4. A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer

    <p>The objective of this dissertation research is to develop a novel three-dimensional (3-D) wire bondless power module package for silicon carbide (SiC) power devices to achieve a low parasitic inductance and an improved thermal performance. A half-bridge module consisting of 900-V SiC MOSFETs is …

    arkansas Repository record for A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer (opens in a new tab)