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Showing 1 to 1 of 1 for “"Multichip modules (Microelectronics)"”.
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Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages
… an enabling technology in the advancement of the microelectronics industry. 3D stacking enables increased device density per volume and improved electrical performance through short vertical interconnect paths. Mechanical reliability of 3D IC packages is critical due to the widespread use of …