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Showing 1 to 4 of 4 for “"Multi-chip Modules"”.

  1. Miniaturizing microvias for multi-chip modules

    … denser packaging. This encompasses a push toward multilevel die, denser metallization, and smaller microvias. In this thesis we investigate the miniaturization of laser-drilled microvias in polyimide dielectric for chips-first multi-chip module (MCM) technology. The challenge is to produce …

    mit Repository record for Miniaturizing microvias for multi-chip modules (opens in a new tab)

  2. Integrated Thermal Management Strategies for Embedded Power Electronic Modules

    … systems approach via integrated power electronic modules (IPEMs) to improve the reliability, cost-effectiveness, and performance of power electronics systems. IPEMs are multi-layered structures based on embedded power technology and offer the advantage of three-dimensional (3D) packaging of …

    vt Repository record for Integrated Thermal Management Strategies for Embedded Power Electronic Modules (opens in a new tab)

  3. A Novel Unit Cell Antenna for Highly Integrated Phased Arrays in the SHF Band

    … agile beam steering, sidelobe control, and multiple independent beams. These capabilities have revolutionized radar, radioastronomy, and communication systems.</p> <p>Phased arrays have increasingly employed printed circuit board (PCB) fabrication techniques and processes to maximize array …

    calpoly Repository record for A Novel Unit Cell Antenna for Highly Integrated Phased Arrays in the SHF Band (opens in a new tab)

  4. High-performance die-to-die interconnects

    Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2026-12-01

    uiuc Repository record for High-performance die-to-die interconnects (opens in a new tab)