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Showing 1 to 1 of 1 for “"Mode I cyclic stress"”.
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Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life
… is investigated in this study. A finite element model is created using Ansys by assuming the existence of an infinite array of solder interconnects, cylindrical in shape, surrounded by underfill material. Axial stresses in the interconnects are determined as a temperature loading is applied. The …