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Showing 1 to 3 of 3 for “"Microelectronic packaging"”.

  1. Design guidelines and synthesis of a low dielectric constant inorganic composite for high performance microelectronic packaging

    This thesis is on theoretical and experimental studies of a controlled porosity inorganic composite using hollow ceramic microspheres. It evaluated the microsphere geometry issues and physical/electrical properties important to achieving a maximum reduction of the dielectric constant of the …

    uiuc Repository record for Design guidelines and synthesis of a low dielectric constant inorganic composite for high performance microelectronic packaging (opens in a new tab)

  2. Constrained sintering of gold circuit films on rigid substrates

    … films made from commercial circuit paste used in microelectronic packaging applications was studied. Constrained gold circuit films of 60-65μm thick were formed by multiple screen printing of the gold paste on rigid alumina substrates, while freestanding films were obtained by carefully peeling …

    vt Repository record for Constrained sintering of gold circuit films on rigid substrates (opens in a new tab)

  3. Modeling and simulation for signal and power integrity of electronic packages

    The objective of this dissertation is to develop electrical modeling and co-simulation methodologies for signal and power integrity of package and board applications. The dissertation includes 1) the application of the finite element method to the optimization for decoupling capacitor selection and …

    gatech Repository record for Modeling and simulation for signal and power integrity of electronic packages (opens in a new tab)