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Showing 1 to 1 of 1 for “"Metals--Fatigue."”.
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Effects of underfill material on solder deformation and damage in 3D packages
This paper will examine the effects of the introduction of a periodic boundary condition and the presence of underfill material on the stress and strain fields and evolution of failure of an FEA model that is representative of a solder joint in a 3D IC package. The model solder joint is placed …