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Showing 1 to 1 of 1 for “"Metal immersion deposition from organic solutions (MIDOS)"”.
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Metal seed deposition from organic solutions for subsequent electroless plating
<p>"A novel process for immersion metal seed layer deposition on electronic material substrates from organic solutions for subsequent electroless Cu plating is being developed. The mechanism is based on spontaneous electrochemical displacement reactions. The more noble metal is reduced and …