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Showing 1 to 1 of 1 for “"Mechanically flexible interconnects"”.
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Hybrid microfluidic cooling and thermal isolation technologies for 3D ICs
… and processor-on-processor. Air gap and mechanically flexible interconnects (MFIs) are proposed for the first time to decrease the vertical thermal coupling between high-power (e.g. processor) and low-power tiers (e.g. memory or nanophotonics). A two-tier testbed with the proposed thermal …