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Showing 1 to 20 of 47 for “"Mechanical Polishing"”.
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Nano-scale scratching in chemical-mechanical polishing
During the chemical-mechanical polishing (CMP) process, a critical step in the manufacture of ultra-large-scale integrated (ULSI) semiconductor devices, undesirable nano-scale scratches are formed on the surfaces being polished. As the width of the interconnect Cu lines continues to shrink to below …
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Multi-scale scratching in chemical-mechanical polishing
… (ULSI) semiconductor devices, the chemical-mechanical polishing (CMP) process is extensively employed. During the CMP process, undesirable scratches are produced on Cu interconnects both by the abrasive particles in the slurry and by the softer pad asperities. In order to meet the stringent …
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Analysis of slurry flow in chemical-mechanical polishing
Chemical-Mechanical Polishing (CMP) is one of the enabling processes used in the manufacture of semiconductor chips. In the relentless progress to make computer chips faster, smaller, and cheaper, the CMP process plays a prominent role. One of its limitations, however, is non-uniform polishing rate …
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Scratching by pad asperities in chemical mechanical polishing
… semiconductor manufacturing process is chemical-mechanical polishing (CMP), which is used to create connecting metal channels above the transistors in a chip. A typical form of this process used in industry is metal CMP. Metal CMP is the process of using a pad combined with an abrasive slurry to …
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Modeling of chemical mechanical polishing for dielectric planarization
Chemical mechanical polishing (CMP) has emerged as the dielectric planarization method of choice since it can reduce topography over longer length scales than traditional techniques. However, CMP still suffers from large die-level layout pattern dependencies and process induced wafer-level …
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Modeling of chemical mechanical polishing for shallow trench isolation
Thesis (S.B. and M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000.
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Modeling of chemical mechanical polishing using fixed abrasive technology
Chemical Mechanical Polishing (CMP) is conventionally carried out using abrasive slurry and a polishing pad. An alternative process is the "fixed abrasive" polish. Existing models, which accurately predict oxide thickness variations across a chip for the conventional CMP process, have not …
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Characterization and modeling of polysilicon MEMS chemical-mechanical polishing
… the manufacture of integrated circuits, chemical-mechanical polishing (CMP) is becoming an enabling technology for microelectromechanical systems (MEMS). To reliably use CMP in the manufacturing process, designers must be able to accurately predict the CMP process and control final surface …
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Optical endpoint detection for the chemical mechanical polishing process
… for detecting the endpoint for the Chemical Mechanical Polishing process of copper wafers. The proposed mechanism will detect the reflectance difference found in semiconductor materials to trigger the stop of the polishing process. This will prevent over polishing of the wafer while ensuring …
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Modeling of chemical mechanical polishing for shallow trench isolation
… the rotor is suspended above the stator via mechanical springs, or tethers. The micro motor is fabricated from thick layers of electroplated NiFe and copper, by our collaborators at Georgia Institute of Technology. The rotor and the stator cores are 4 mm in diameter each, and the entire motor …
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Characterization and modeling of uniformity in chemical mechanical polishing
Thesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999.
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Axiomatic system design : chemical mechanical polishing machine case study
… study of the design of a machine tool system for polishing silicon wafers using chemical mechanical polishing (CMP) is presented. The CMP system architecture is decomposed from top level requirements using the principles of axiomatic design, and the theorems developed in this thesis. The CMP …
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Device independent process control of dielectric chemical mechanical polishing
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, February 2000.
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Face-up chemical mechanical polishing : kinematics and material removal rate
… qualitatively correspond with the theoretical polishing model. Discrepancies in data from the theoretical model could potentially be caused by non-uniform loading of the polishing pad and uneven distribution of slurry over the pad due to the edge effects on fluid flow. Despite the …
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Mechanics, mechanisms, and modeling of the chemical mechanical polishing process
… other planarization techniques, the Chemical Mechanical Polishing (CMP) process produces excellent local and global planarization at low cost. It is thus widely adopted for planarizing inter-level dielectric (silicon dioxide) layers. Moreover, CMP is a critical process for fabricating the Cu …
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Micro-scale scratching by soft pad asperities in chemical-mechanical polishing
… of integrated circuits (IC) and micro-electromechanical systems (MEMS), chemical-mechanical polishing (CMP) is widely used for providing local and global planarization. In the CMP process, polishing pads, typically made of polyurethanes, play a key role. Due to the random, rough surface of the …
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Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Chemical mechanical polishing (CMP) has become a necessary processing step in the fabrication of copper interconnects. Copper CMP is recognized to suffer from pattern dependent problems such as dishing and erosion, which cause increased line resistance and non-uniformity within the die. The …
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Modeling of dielectric erosion and copper dishing in copper chemical-mechanical polishing
… planarization capabilities of the chemical-mechanical polishing (CMP) process. At present, copper is widely used as the interconnect material in the ULSI technology. The greatest challenge in Cu CMP now is the control of wafer surface non-uniformity-primarily due to dielectric erosion and …
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Novel techniques for the run by run process control of chemical-mechanical polishing
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1996.
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Evaluation of Electrochemical and Laser Polishing of Selectively LaserMelted 316L Stainless Steel
… hard to reach features, preventing conventional mechanical polishing from being successful. Therefore, it is necessary to evaluate non-mechanical polishing processes as treatments for surface roughness. In this study, electrochemical and laser polishing were investigated as potential …
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