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Showing 1 to 1 of 1 for “"Materials--Dynamic testing--Mathematical models"”.
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Numerical study of solder joint failure under fast loading conditions
… The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model was incorporated into the rate-dependent constitutive response of the Sn (tin)-Ag (silver)-Cu (copper) solder alloy, resulting in …