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Showing 1 to 1 of 1 for “"Manufacture Of Microelectomechanical Systems (MEMS) Devices"”.
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Ultrathin silicon wafer bonding physics and applications
… increases yield, and allows the realization of novel devices. Ultrathin silicon wafers are between 3 and 200 microns thick with all the same properties of the thicker silicon wafers (greater than 300 microns) normally used by the semiconductor electronics industry. Wafer bonding is one …