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Showing 1 to 7 of 7 for “"MIM capacitor"”.
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Electrical characterization of plasma-enhanced Cvd silicon nitride dielectric on copper
In this work, a novel metal-insulator-metal (MIM) capacitor process is introduced and integrated in a Copper Interconnect technology, whose smallest feature size is 0.18mum process, which has good yield, reliability and repeatability. The MIM uses a one-photomask process and hence is termed as the …
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Selected topics on advanced electron devices and their circuit applications
… high quality inductor as well as high-I? MIM capacitor, showing promising characteristics for future ULSI application.
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High-K Dielectrics in Metal Insulator Metal (MIM) Capacitors for RF Applications
… challenges faced by the metal-insulator-metal (MIM) capacitor technology for the radio frequency (RF) and analog-mixed signal (AMS) applications. The MIM capacitors for the RF and AMS applications have requirements of high capacitance densities and low quadratic voltage coefficients of …
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Design and analysis of ultra-wide band and millimeter-wave antennas
… validated for modeling a spiral inductor and an MIM capacitor in a wide bandwidth. Next, a new compact and multilayer UWB planar antenna was designed using the low temperature co-fired ceramics (LTCC) technology, which gives the possibility of integrating RF circuits and antennas in a single …
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An investigation of high-k materials in metal-insulator-metal capacitor structures
Metal insulator metal (MIM) capacitors are vital components of many devices such as communication band beamformers, medical, automotive, RF IC’s and memory applications. Current MIM capacitors technology utilises low dielectric constant (k) materials (k~3.9 - 7), these materials achieve the …
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Atomic vapor depositions of metal insulator metal capacitors : investigation, development and integration
Metall-Isolator-Metall (MIM) Kondensatoren gehören zu den wichtigsten passiven Komponenten in Hochfrequenzbauelementen und Schaltkreisen für Analog/Mischsignale. Unabhängig von der Anwendung beanspruchen MIM-Kondensatoren bis zu 50 % der Chipfläche. Dies unterstützt maßgeblich die Chipfläche zu …
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Interconnect design techniques for multicore and 3D Integrated circuits.
… a novel paradigm where we exploit a new type of capacitor, the metal-insulator-metal (MIM) capacitor, together with the traditional CMOS decaps, to optimize the power supply noise in 3D chips. Experimental results show that power grid noise can be more effectively optimized after the introduction …