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Showing 1 to 2 of 2 for “"MEMS Packaging"”.
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Mechanics aspects of water thermocompression bonding
… technique for microelectromechanical systems (MEMS) packaging. The process is a form of solid-state joining and requires the simultaneous application of temperature and pressure to wafers patterned with metallic thin films in order to bring the mating surfaces into atomic proximity. The quality …
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Design, Fabrication and Testing of Conformal, Localized Wafer-level Packaging for RF MEMS Devices
A low-cost, low-temperature packaging concept is proposed for localized sealing and control of the ambient of a device cavity appropriate for Radio-Frequency (RF) Micro- Electro-Mechanical (MEMS) devices, such as resonators and switches. These devices require application specific packaging to …