Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 9 of 9 for “"Low-temperature sintering"”.
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The low-temperature sintering behavior of (La,Ca)CrO₃
… purpose of this study was to develop methods of sintering this material in air at temperatures below 1500°C. The results are compiled into three papers.</p> <p>The first paper discusses the formation of pure and Ca doped lanthanum chromate (LaCrO<sub>4</sub>). This compound transforms to …
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Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection
… relationships of low-temperature sintering of nanoscale silver pastes. The nanoscale silver pastes have been formulated by adding organic components (dispersant, binder and thinner) into nano-silver particles. The selected organic components have the nano-particle …
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Processing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste
… alternative to solder for die-attachment at sintering temperature below 300 °C without applying any pressure. Typically, the substrate, such as direct bond copper (DBC) substrates, has surface metallization such as silver or gold to protect the copper surface from oxidation during the …
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Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects
… methodologies to reduce contact resistance: low temperature sintering, fast sintering and in-situ reduction. Furthermore, two approaches, surface modification and in-situ protection, were developed to prevent oxidation and corrosion of silver-coated copper flakes to produce low cost ICAs. The …
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Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
This thesis examines the packaging of high-temperature SiC power electronic devices. Current-voltage measurements were conducted on as-received and packaged SiC power devices. The planar structure was introduced and developed as a substitution for traditional wire-bonding vertical structure. The …
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Sintering behavior of Ag-Sn alloys prepared via cryogenic high-energy ball milling
… there is a need to develop high temperature die-attach materials that are mechanically stable at operating temperatures of 300◦C and provide excellent thermal conductivity between die and substrate materials. There are no obvious choices for all applications, however, low …
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A diffusion-viscous analysis and experimental verification of the drying behavior in nanosilver-enabled low-temperature joining technique
The low-temperature joining technique (LTJT) by silver sintering is being implemented by major manufacturers of power electronics devices and modules for bonding power semiconductor chips. A common die-attach material used with LTJT is a silver paste consisting of silver powder (micron- or …
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Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
… material and substrate technology for high-temperature applications. For the die-attach material, a low-temperature sintering technique enabled by a nanoscale silver paste was developed for attaching large-area (>100 mm2) semiconductor chips. The nanoscale silver paste can be sintered at a …
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Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
… including conductive adhesives and reflowed solders, can not meet the advance of power conversation application. Silver paste sintering has been widely used in microelectronics and been demonstrated the superior properties. The high processing temperature, however, prevents its …