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Showing 1 to 7 of 7 for “"Low temperature co-fired ceramics"”.
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Low Temperature Co-fired Ceramics Technology for Power Magnetics Integration
This dissertation focuses on the development of low-temperature co-fired ceramics (LTCC) technology for power converter magnetics integration. Because magnetic samples must be fabricated with thick conductors for power applications, the conventional LTCC process is modified by cutting trenches in …
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Design and analysis of ultra-wide band and millimeter-wave antennas
… for developing high-speed short-range wireless communications. Firstly, a probe-fed crossed circle-disk monopole UWB antenna with stable omnidirectional radiation pattern was studied. The antenna was then cut by half to form a crossed semi-circle monopole antenna with a top-loaded patch to …
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Contribución a la fabricación de heteroestructuras basadas en nitruros semiconductores para dispositivos más eficientes y baratos
La investigación recogida en la presente tesis versa sobre aquellos materiales III-N que constituyen películas delgadas y/o nanoestructuras basadas en los compuestos GaN, InN y AlN, o en las aleaciones ternarias de InGaN, depositadas sobre substratos no nativos (de composición distinta a la del …
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Packaging of a High Power Density Point of Load Converter
… for today's microprocessors, point of load converter packaging is becoming an important issue. Traditional thermal management techniques involved in removing heat from a printed circuit board are being tested as today's technologies require small footprint and volume from all electrical …
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Low-Profile Magnetic Integration for High-Frequency Point-of-Load Converter
… is also known as a high current Point-of-Load converter (POL). These circuits are mostly constructed using discrete components, and populated on the motherboard. With this solution, the passive components such as inductors and capacitors are bulky. They occupy a considerable footprint on the …
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Packaging and Magnetic Integration for Reliable Switching of Paralleled SiC MOSFETs
Silicon carbide (SiC) outperform Si chips in terms of high blocking voltage capability, low on-resistance, high-temperature operation, and high switching frequency. Several SiC MOSFETs are usually paralleled to increase current capability, considering cost effectiveness and manufacturability. For a …
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Processing to Enable Direct-Write Additive Manufacturing of Ceramics and Ceramic Composites
… writing (DIW) and Ceramic On-Demand Extrusion (CODE) manufacturing processes, in order to produce ceramic and ceramic-based composite components. Strongly dispersed, concentrated (φ = 0.42), nanoparticle (d<sub>50</sub> ~0.3 µm), zirconia (ZrO<sub>2</sub>) pastes were used to print densely …