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Showing 1 to 1 of 1 for “"Lead-free solution"”.
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Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection
This research has developed a lead-free semiconductor device interconnect technology by studying the processing-microstructure-property relationships of low-temperature sintering of nanoscale silver pastes. The nanoscale silver pastes have been formulated by adding organic components (dispersant, …