Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 8 of 8 for “"Lead-free solder joints"”.
-
Strain-rate Dependent Fracture Load Prediction of Lead-free Solder Joints
… has been shown to govern the fracture of short solder joints. The present work measured Jci for 2 mm long SAC305 solder joints as a function of the strain rate and phase angle using DCB specimens. A drop tester was designed and built to perform the experiments at higher strain rates. Jci …
-
Effect of temperature on the fracture behavior of lead-free solder joints
… on the fracture behavior of Cu-SAC305-Cu joints. To this end, double cantilever beam (DCB) specimens, consisting of a thin layer of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars, fabricated under standard surface mount (SMT) processing conditions are fractured under …
-
Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints
… forces for considering alternative materials to lead- based products, specifically interconnections, in electronics applications, including the impending legislation or regulations which may tax, restrict, or eliminate the use of lead and the trend toward advanced interconnection technology, …
-
Modelling of the reliability of flip chip lead-free solder joints at high-temperature excursions
… devices, Tin-Silver-Copper (SnAgCu) alloy solder joints used to assemble the component of the devices are functioning at homologous temperature above 0.8. In such ambient temperatures, solder alloys have limited mechanical strength and will be sensitive to strain rate. The sensitivity of …
-
Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints
Solder joints play a very important role in electronic products as the integrity of electronics packaging and assembly rests on the quality of these connections. The increasing demands for higher performance, lower cost, and miniaturisation in hand-held and consumer electronic products have led to …
-
Drop Impact Reliability Testing Lead-Free Chip Scale Packages
… The drop event may result in failure of solder joints inside these devices. The importance and widespread use of these devices in both business and leisure activities continues to increase, so device failure is increasingly costly and inconvenient. Recently the European Union (EU) …
-
Testing and inverse modelling for solder joint reliability assessment
… any sign of slowing down, the reliability of lead free solder joints with diminishing size has become more and more a challenge to the design engineers and the electronics manufacturing industry. In order to predict the reliability of solder joints accurately, it is necessary to develop test …
-
A study of the thermomechanical reliability of solder joints in surface mount electronics technology
Solder joints have been an integral part of any electronic assembly. They serve as both the electrical and mechanical connections between surface mount component and the substrate. This function is crucial in Surface Mount Technology (SMT) owing to its capability in supporting the realisation of …