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Showing 1 to 19 of 19 for “"Lead-Free Solder"”.
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Strain-rate Dependent Fracture Load Prediction of Lead-free Solder Joints
… has been shown to govern the fracture of short solder joints. The present work measured Jci for 2 mm long SAC305 solder joints as a function of the strain rate and phase angle using DCB specimens. A drop tester was designed and built to perform the experiments at higher strain rates. Jci …
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Effect of temperature on the fracture behavior of lead-free solder joints
… of a thin layer of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars, fabricated under standard surface mount (SMT) processing conditions are fractured under various temperatures with a MTS machine equipped with an environment chamber. The load-displacement behavior …
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Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints
… forces for considering alternative materials to lead- based products, specifically interconnections, in electronics applications, including the impending legislation or regulations which may tax, restrict, or eliminate the use of lead and the trend toward advanced interconnection technology, …
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Creep behaviour of the ternary lead-free solder alloy : Sn-3.8wt.%Ag-0.7wt.%Cu
… of both miniaturisation and the need to replace lead in interconnections. In service, interconnections generally fail by thermomechanical fatigue, and this behaviour is strongly affected by the creep process. This thesis examines the creep behaviour of a popular lead-free replacement alloy, …
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Characterisation of lead-free solder pastes and their correlation with the stencil printing process performance
Solder pastes are complex materials whose properties are governed by many factors. Variations exhibited in solder paste characteristics make it increasingly difficult to understand the correlations between solder paste properties and their printing process performance. The recent EU directives on …
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Modelling of the reliability of flip chip lead-free solder joints at high-temperature excursions
… devices, Tin-Silver-Copper (SnAgCu) alloy solder joints used to assemble the component of the devices are functioning at homologous temperature above 0.8. In such ambient temperatures, solder alloys have limited mechanical strength and will be sensitive to strain rate. The sensitivity of …
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Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices
… evaluated the thermo-mechanical reliability of lead-free packaging techniques for attaching large-area chip. With 3 MPa pressure, a low-temperature (<300oC) sintering technique enabled by a nano-scale silver paste was developed for attaching 100 mm2 silicon die. This new lead-free packaging …
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Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints
Solder joints play a very important role in electronic products as the integrity of electronics packaging and assembly rests on the quality of these connections. The increasing demands for higher performance, lower cost, and miniaturisation in hand-held and consumer electronic products have led to …
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Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device
… the interface. Extensive review shows that solder thermal interface materials (STIMs) apparently offer better thermal performance than comparable state-of-the-art commercial polymer-based TIMs and thus a preferable choice in packaging power devices. Nonetheless, voiding remains a major …
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Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications
… an increasing demand for better understanding of soldering technology, particularly in the area of solder pastes used in the reflow soldering of surface mount devices. Successful assembly of electronic devices for ultra-fine pitch and flip-chip applications requires the deposition of small and …
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Tuning and parameter optimization of a digital integral controller for uniform droplet spray applications using lead-free tin-copper solder
The advent of legislation restricting the use of lead in electronics requires innovation and refinement in processes for creating lead-free solder spheres for wafer bumping and other surface mount technology. Operation improvements were made upon a uniform droplet spray apparatus, and its digital …
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Flex Cracking and Temperature-Humidity-Bias Effects on Reliability of Multilayer Ceramic Capacitors
… causes stresses to be transmitted through the solder fillets to the surface mount capacitors. These stresses are the highest at the bottom of the capacitor, where the termination bands end. In order to reduce the amount of stress that is transmitted to the brittle ceramic body of MLCCs through …
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Testing and inverse modelling for solder joint reliability assessment
… any sign of slowing down, the reliability of lead free solder joints with diminishing size has become more and more a challenge to the design engineers and the electronics manufacturing industry. In order to predict the reliability of solder joints accurately, it is necessary to develop test …
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Technology, science, and environtmental impact of a novel Cu-Ag core-shell solderless interconnect system
<p>Tin-based solder is ubiquitous in microelectronics manufacturing and plays a critical role in electronic packaging and attachment. While manufacturers of consumer electronics have made the transition to the use of lead-free solder, there are still a variety of reliability issues associated with …
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
Solder joints have been an integral part of any electronic assembly. They serve as both the electrical and mechanical connections between surface mount component and the substrate. This function is crucial in Surface Mount Technology (SMT) owing to its capability in supporting the realisation of …
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Computer simulation of electromigration in microelectronics interconnect
… current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging design and manufacturing, and it will become an even greater challenge for the semiconductor assembly …
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Drop Impact Reliability Testing Lead-Free Chip Scale Packages
… The drop event may result in failure of solder joints inside these devices. The importance and widespread use of these devices in both business and leisure activities continues to increase, so device failure is increasingly costly and inconvenient. Recently the European Union (EU) …
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Interfacial reaction between SAC305 and SAC405 lead-free solders and electroless nickel/immersion silver (ENImAg) surface finish
The different surface finish and solder size on printed circuit board strongly affect the formation of intermetallic compounds (IMCs) and solder joint reliability. Among of various surface finish in the electronic industry, electroless nickel/immersion gold is the most popular at the moment. …
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Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability
… Nanosilver sintering has becoming an emerging solder-free, environmental friendly die-attach technology. Researchers have demonstrated the feasibility of die-attachment on silver (Ag) or gold (Au) surfaces by pressure-less or low-pressure (< 5 MPa) nanosilver sintering. This study extended the …