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Showing 1 to 1 of 1 for “"Large-Area Solder Bond"”.

  1. Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints

    … which may challenge the limits of present soldering technology. The reliability of solder joints is a concern because fracture failures in solder joints accounts for 70% of failures in electronic components. Lead-free solders are being investigated as replacements for lead solders currently …

    vt Repository record for Microstructural Evolution in Thermally Cycled Large-Area Lead and Lead-Free Solder Joints (opens in a new tab)