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Showing 1 to 3 of 3 for “"Joints (Engineering)"”.
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Effects of underfill material on solder deformation and damage in 3D packages
This paper will examine the effects of the introduction of a periodic boundary condition and the presence of underfill material on the stress and strain fields and evolution of failure of an FEA model that is representative of a solder joint in a 3D IC package. The model solder joint is placed …
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Numerical study of solder joint failure under fast loading conditions
A numerical study was undertaken to investigate the solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates. A progressive ductile damage model was incorporated into the …
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A framework for designing interlayers for ceramic-to-metal joints
Engineering ceramics have become widely used as structural materials due to their excellent mechanical and thermal properties at high temperature. In most structural applications, ceramics are integrated as critical components in a system that is largely metallic and have to be joined frequently to …