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Showing 1 to 1 of 1 for “"Interconnects (Integrated circuit technology)"”.
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Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages
Three-dimensional (3D) stacking of integrated circuits (ICs) is an enabling technology in the advancement of the microelectronics industry. 3D stacking enables increased device density per volume and improved electrical performance through short vertical interconnect paths. Mechanical reliability …