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Showing 1 to 20 of 408 for “"Interconnects"”.

  1. Passive microfluidic interconnects

    … being compressed into undersized sockets. Interconnects were tested in pairs and arrays. The sealing performance of the first design was found to be highly dependent on the material and surface finish of the features, and the design was found to be largely intolerant to the misalignment …

    mit Repository record for Passive microfluidic interconnects (opens in a new tab)

  2. Characterization of optical interconnects

    … and low-k dielectrics, parasitic effects of interconnects will eventually impede advances in integrated electronics. One technique that has the potential to provide a paradigm shift is optics. This project evaluates the feasibility of optical interconnects for distributing data and clock …

    mit Repository record for Characterization of optical interconnects (opens in a new tab)

  3. Reversible concentric ring microfluidic interconnects

    … capability. Macro scale devices show that the interconnects function as designed and seal up to 80 psi. Micro scale devices have been fabricated, engage as designed and are much stronger than anticipated, however pressure tests have not yet been conducted.

    mit Repository record for Reversible concentric ring microfluidic interconnects (opens in a new tab)

  4. High-performance die-to-die interconnects

    Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2026-12-01

    uiuc Repository record for High-performance die-to-die interconnects (opens in a new tab)

  5. Receivers for energy efficient optical interconnects

    … of servers are connected with high bandwidth interconnects. Optical interconnects are increasingly deployed within the data centers to meet the growing bandwidth requirements. Both intensity modulation direct detection (IM-DD) optical links and coherent optical links are employed. The …

    uiuc Repository record for Receivers for energy efficient optical interconnects (opens in a new tab)

  6. Carbon nanotube interconnects for IC chips

    … the existing copper-based technologies as interconnects for Integrated Circuit (IC) chips. Being ballistic conductors, CNTs are capable of carrying higher current densities of up to 10¹⁰A/cm² and high thermal conductivity. This thesis examines the technological aspect of carbon nanotubes - …

    mit Repository record for Carbon nanotube interconnects for IC chips (opens in a new tab)

  7. Design space exploration of photonic interconnects

    … Recognizing potential limits of electrical interconnects, emerging nanophotonic integration has been recently proposed as a potential technology option for both on-chip and chip-to-chip applications. As optical links avoid the capacitive, resistive and signal integrity limits imposed upon …

    mit Repository record for Design space exploration of photonic interconnects (opens in a new tab)

  8. Hierarchical electromigration reliability diagnosis for ULSI interconnects

    … density. In recent years, the line width of ULSI interconnects has been shrunk into the submicron regime. This gives rise to serious concerns about electromigration-induced failures.

    uiuc Repository record for Hierarchical electromigration reliability diagnosis for ULSI interconnects (opens in a new tab)

  9. Carbon nanotube synthesis for integrated circuit interconnects

    … been identified as ideal replacements for copper interconnects in integrated circuits given their higher current density, inertness, and higher resistance to electromigration. Although at the laboratory level CNTs have proven their technical viability as interconnects, fabrication issues such as …

    mit Repository record for Carbon nanotube synthesis for integrated circuit interconnects (opens in a new tab)

  10. Reliability of copper interconnects in integrated circuits

    … densities increase, the reliability of metal interconnects becomes a serious concern. In copper interconnects, the dominant diffusion path is along the interface between the copper and the top passivation layer (usually Si3N4). One of the predominant failure mechanisms in Cu has been …

    mit Repository record for Reliability of copper interconnects in integrated circuits (opens in a new tab)

  11. Analysis of column interconnects for wafer level packages

    … based on modeling chip/substrate as shells and interconnects as beams, together with shell-to-solid coupling and submodeling techniques, were developed to address the modeling difficulty of CuC interconnect in large packages with ultra-fine pitch. A feasibility demonstration of the two …

    nus Repository record for Analysis of column interconnects for wafer level packages (opens in a new tab)

  12. Broadband Macromodeling Techniques for Interconnects and Electronic Packages

    In this dissertation, new techniques are proposed to generate an accurate broadband macromodel for passive interconnect and packages. The physical characteristics of the structures such as stability, causality, and passivity are preserved during the model construction. Also, a new method is …

    uiuc Repository record for Broadband Macromodeling Techniques for Interconnects and Electronic Packages (opens in a new tab)

  13. Evaluation of phase change materials for reconfigurable interconnects

    The possible use of programmable integrated circuit interconnect vias using an indirectly heated phase change material is evaluated. Process development and materials investigations are examined. Devices capable of multiple cycles between on/off states for reconfigurable applications have been …

    mit Repository record for Evaluation of phase change materials for reconfigurable interconnects (opens in a new tab)

  14. An optical data receiver for integrated photonic interconnects

    … each other as well as off-chip memory, global interconnects have become a major bottleneck. The solution has been proposed through integrated photonic networks, where multiple channels of information can be placed onto a single low-latency waveguide, reducing the number of interconnects and …

    mit Repository record for An optical data receiver for integrated photonic interconnects (opens in a new tab)

  15. Investigating thermal dependence on monolithically-integrated photonic interconnects

    Monolithically-integrated optical link is a disruptive technology which has the promising potential to remove memory bandwidth bottleneck in the deep multicore regime. Although with the advantages of high bandwidth-density and energy-efficiency, it comes with design challenges from device, …

    mit Repository record for Investigating thermal dependence on monolithically-integrated photonic interconnects (opens in a new tab)

  16. Modeling for the Computer-Aided Design of Long Interconnects

    L'abstract è presente nell'allegato / the abstract is in the attachment

    poli-torino Repository record for Modeling for the Computer-Aided Design of Long Interconnects (opens in a new tab)

  17. Model-Order Reduction Techniques for Circuits and Interconnects Simulation

    The basic goal of this dissertation is to extend the use of order-reduction techniques as accurate methods for analyzing complex electronic systems. The theoretical and practical aspects of moment-matching, Krylov subspace-based methods, and rational approximations techniques are studied. The …

    uiuc Repository record for Model-Order Reduction Techniques for Circuits and Interconnects Simulation (opens in a new tab)

  18. Crosstalk mitigation of high-speed interconnects using modal signaling

    … technology limitations, the resources (pins and interconnects) available for off-chip signaling remain almost constant, while the throughput needed is increasing and the required aggregate bandwidths are moving into the Tb/s range. The solutions need to simultaneously satisfy the requirements for …

    uiuc Repository record for Crosstalk mitigation of high-speed interconnects using modal signaling (opens in a new tab)

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