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Showing 1 to 3 of 3 for “"Interconnect line"”.
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Carbon nanotube applications for CMOS back-end processing
… first application is as a replacement for copper interconnects. As interconnect line widths shrink, the electrical resistivity of copper will rise dramatically due to surface scattering effects. Carbon nanotube ballistic transporters may be able to overcome this obstacle, as well as being able to …
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Studying the effect of Cu microstructure on electromigration reliability using statistical simulation
… process due to void growth for on-chip interconnects when subjected to high electric current densities and eventual interconnect line failure. The mass transport occurs in decreasing order of magnitude along interfaces grain boundaries and in bulk. The diffusivities along interfaces and …
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Charakterisierung und Optimierung elektrochemisch abgeschiedener Kupferdünnschichtmetallisierungen für Leitbahnen höchstintegrierter Schaltkreise
Die Entwicklung der Mikroelektronik wird durch eine fortschreitende Miniaturisierung der Bauelemente geprägt. Infolge einer Reduzierung der Querschnittflächen von Leitbahnstrukturen erhöht sich die elektrische Leistungsdichte und das Metallisierungssystem bestimmt zunehmend die …