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Showing 1 to 5 of 5 for “"Integrated power electronics modules"”.

  1. Describing Integrated Power Electronics Modules using STEP AP210

    The software environment for power electronics design is comprised of tools that address many interrelated disciplines including circuits design, physical layout, thermal management, structural mechanics, and electromagnetics. This usually results in a number of separate models that provide various …

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  2. Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules

    … need for the introduction of high reliability power electronics in converting the raw form of electricity into efficient electricity for these applications is uprising. One of the most common failures in power electronics is temperature related failure such as overheating. To address the issue …

    vt Repository record for Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules (opens in a new tab)

  3. Planar metallization failure modes in integrated power electtonics modules

    Miniaturizing circuit size and increasing power density are the latest trends in modern power electronics development. In order to meet the requirements of higher frequency and higher power density in power electronics applications, planar interconnections are utilized to achieve a higher …

    vt Repository record for Planar metallization failure modes in integrated power electtonics modules (opens in a new tab)

  4. Generalized Frequency Plane Model of Integrated Electromagnetic Power Passives

    The challenge to put power electronics on the same cost reduction spiral as integrated signal electronics has yet to be met. In the ongoing work for achieving complete power electronic converter integration, it has proven to be essential to develop a technology for integration of electromagnetic …

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  5. Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips

    Circuit assembly and packaging technologies for power electronics have not kept pace with those for digital electronics. Inside those packaged power devices as well as the state-of-the-art power modules, interconnection of power chips is accomplished with wirebonds. Wirebonds in power devices and …

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