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Showing 1 to 9 of 9 for “"Integrated circuits--Design and construction"”.

  1. Circuit designs for low-power and SEU-hardened systems

    The desire to have smaller and faster portable devices is one of the primary motivations for technology scaling. Though advancements in device physics are moving at a very good pace, they might not be aggressive enough for now-a-day technology scaling trends. As a result, the MOS devices used for …

    unm Repository record for Circuit designs for low-power and SEU-hardened systems (opens in a new tab)

  2. Effects of underfill material on solder deformation and damage in 3D packages

    … introduction of a periodic boundary condition and the presence of underfill material on the stress and strain fields and evolution of failure of an FEA model that is representative of a solder joint in a 3D IC package. The model solder joint is placed between two silicon substrates in contact …

    unm Repository record for Effects of underfill material on solder deformation and damage in 3D packages (opens in a new tab)

  3. Chemistry, Detection, and Control of Metals during Silicon Processing

    … focuses on the chemistry, detection, and control of metals and metal contaminants during manufacturing of integrated circuits (ICs) on silicon wafers. Chapter 1 begins with an overview of IC manufacturing, including discussion of the common aqueous cleaning solutions, metallization …

    unt Repository record for Chemistry, Detection, and Control of Metals during Silicon Processing (opens in a new tab)