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Showing 1 to 13 of 13 for “"IR-drop"”.

  1. Power grid verification and optimization

    IR-drop is the voltage drop that is caused by the impedance of power grid and devices' switchings. It is important to verify voltage values of nodes on power grids. To make the circuit work reliably, it is preferable to reduce the voltage drops. Nowadays, power grids are usually in large size, …

    uiuc Repository record for Power grid verification and optimization (opens in a new tab)

  2. One Dimensional Approach to Modeling Damage Evolution in Galvanic Corrosion

    … of changing area ratio, electrolyte thickness, IR drop, and Wagner relationship for each system. Fully derived 1D governing equations for additional geometries are also proposed.

    ohiolink Repository record for One Dimensional Approach to Modeling Damage Evolution in Galvanic Corrosion (opens in a new tab)

  3. Multiphysics modeling and simulation for large-scale integrated circuits

    … related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to address multiple …

    uiuc Repository record for Multiphysics modeling and simulation for large-scale integrated circuits (opens in a new tab)

  4. Modeling the operating voltage of liquid metal battery cells

    … discharge. Emf measurements were used to confirm the literature values for Mg-Sb liquid alloys and calibrate a two-phase Mg-Sb reference electrode. The charge transfer kinetics at the alloying electrode were studied using the galvanostatic pulse method and a novel working electrode design. The …

    mit Repository record for Modeling the operating voltage of liquid metal battery cells (opens in a new tab)

  5. Power distribution network modeling and microfluidic cooling for high-performance computing systems

    … simulations. Compared to the conventional air cooling, significant reductions in system temperature and thermal coupling are achieved with the proposed platform. Moreover, the signaling performance is improved due to the reduced temperature, especially for long interconnects on the silicon …

    gatech Repository record for Power distribution network modeling and microfluidic cooling for high-performance computing systems (opens in a new tab)

  6. Delay Testing in Nanoscale Technology under Process Variations

    … have significantly increased impact on the circuit behavior with continuously scaled transistor sizes. Manufactured devices tend to have different performances due to parameter variations during manufacturing and in the operating context. Conventional tests generated regardless of variations …

    passau-thes Repository record for Delay Testing in Nanoscale Technology under Process Variations (opens in a new tab)

  7. Understanding Liquid-Air Interface Corrosion of Steel in Simplified Liquid Nuclear Waste Solutions

    Carbon steel is susceptible to the liquid-air interface (LAI) corrosion in liquid nuclear waste and in simulants, but a precise understanding of the mechanism is still missing. This work aimed to expand the understanding of the LAI corrosion mechanism.LAI corrosion was found to initiate at the very …

    ohiolink Repository record for Understanding Liquid-Air Interface Corrosion of Steel in Simplified Liquid Nuclear Waste Solutions (opens in a new tab)

  8. TRANSITION METAL COATINGS FOR ENERGY CONVERSION AND STORAGE; ELECTROCHEMICAL AND HIGH TEMPERATURE APPLICATIONS

    … metal oxide and sulfide electrodes such as RuO2, IrO2, TiS2, and MoS2 exhibit rapid faradaic electron–transfer reactions combined with low resistance. The pseudocapacitance of RuO2 is about 720 F/g, and is 100 times greater than double-layer capacitance of activated carbon electrodes. Due to the …

    siu-theses Repository record for TRANSITION METAL COATINGS FOR ENERGY CONVERSION AND STORAGE; ELECTROCHEMICAL AND HIGH TEMPERATURE APPLICATIONS (opens in a new tab)

  9. Interconnect design techniques for multicore and 3D Integrated circuits.

    … by continuously shrinking transistor and wire dimensions. Three dimensional (3D) circuit technology, with multiple tiers of active devices stacked above each other, is a key approach to achieve increasing levels of integration and performance in the future. Concomitant with exponentially …

    umn Repository record for Interconnect design techniques for multicore and 3D Integrated circuits. (opens in a new tab)

  10. Design of power delivery networks for noise suppression and isolation using power transmission lines

    … networks (PDNs), the PDN impedance is required to be less than the target impedance over the frequency range of interest to minimize the IR drop and to suppress the inductive noise during data transitions. As a result, most PDNs in high-speed systems consist of power and ground planes to …

    gatech Repository record for Design of power delivery networks for noise suppression and isolation using power transmission lines (opens in a new tab)

  11. The Role of Time Variant Resistance and Electromotive Force in Ionic Systems Related to Cell Membranes: The Excitability Properties of Frog Skin and Toad Bladder

    … to gradients of electrochemical potential. As a direct consequence of these equations, we have seen that the potential difference between two points in a solution is the sum of two terms: an intrinsic electromotive force (emf.) associated with the gradients of ionic concentrations, and an ohmic …

    rockefeller Repository record for The Role of Time Variant Resistance and Electromotive Force in Ionic Systems Related to Cell Membranes: The Excitability Properties of Frog Skin and Toad Bladder (opens in a new tab)

  12. Application of the latency insertion method (LIM) to the analysis of large circuit interconnect networks

    … insertion method (LIM) to the analysis of circuit interconnects. Special attention is devoted to addressing the issues that arise in very large networks such as on-chip signal and power distribution networks. We demonstrate that the LIM has the power and flexibility to handle various types …

    uiuc Repository record for Application of the latency insertion method (LIM) to the analysis of large circuit interconnect networks (opens in a new tab)