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Showing 1 to 1 of 1 for “"IGBT multi-chip module"”.
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Electrical and Thermal Characterizations of IGBT Module with Pressure-Free Large-Area Sintered Joints
… during the sintering stage for attaching power chips with area larger than 100 mm2. This extra pressure increased the complexity of the sintering process. The maximum chip size processed by pressure-free sintering, in the published resources, was 6 x 6 mm2. One objective of this work was to …