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Showing 1 to 9 of 9 for “"IEC 61000-4-2"”.

  1. Evaluation of the practicality of system efficient ESD design

    … response of the integrated circuit (IC) to an IEC 61000-4-2 discharge. Electrostatic discharge (ESD) gun zaps are applied to the test board; simulated and measured waveforms are compared.

    uiuc Repository record for Evaluation of the practicality of system efficient ESD design (opens in a new tab)

  2. Investigating soft failures induced by system-level ESD

    … following the system-level ESD standard (IEC 61000-4-2), matching real-world testing and events. Soft failures resulting from ESD were seen on all products tested. Failures associated with the peripheral ICs occur independently of the application being run; the application-dependent …

    uiuc Repository record for Investigating soft failures induced by system-level ESD (opens in a new tab)

  3. Detection of ESD-induced soft errors

    IEC-61000-4-2 compliant ESD discharges are performed on a microcontroller. The effect of ESD-induced noise on a digital system having a workload is examined. UART interface present on-chip is used for memory and register readout. Hardware voltage monitors developed previously are included in the …

    uiuc Repository record for Detection of ESD-induced soft errors (opens in a new tab)

  4. Enhanced modeling methodology for system-level electrostatic discharge simulation

    … enable the development of a model for an IEC 61000-4-2 ESD source that comprehends the coupling among the ground straps and the ground plane. The transient-voltage-suppressor device is modeled using a behavioral snapback model that shows better convergence in circuit simulation than …

    uiuc Repository record for Enhanced modeling methodology for system-level electrostatic discharge simulation (opens in a new tab)

  5. Radio frequency interference (RFI) modeling of complex modules in mobile devices and system-level modeling for transient ESD simulation

    … method and discusses its validation using IEC 61000-4-2 ESD pulses on a real-world product. The system model is composed of high current and broadband (up to 3GHz) models of R, L, C, ferrite beads, diodes, and integrated circuit IO pins. A complex return path model is the key to correctly …

    must-thes Repository record for Radio frequency interference (RFI) modeling of complex modules in mobile devices and system-level modeling for transient ESD simulation (opens in a new tab)

  6. Characterization and modeling of ESD events, risk and protection

    … all the ESD scenarios have been specified by the IEC standard and the characterizations of the ESD risk for different scenarios are essential to evaluate the ESD robustness of the devices in the real word. </p><p>The insulation of plastic enclosures provides protection against ESD to the …

    must-thes Repository record for Characterization and modeling of ESD events, risk and protection (opens in a new tab)

  7. Failures caused by supply fluctuations during system-level ESD

    It is necessary to design robust electronic systems against system-level electrostatic discharge (ESD). In additional to withstanding ESD without hard failures (permanent damage), it is important that the system is robust against soft failures (recoverable loss of function or data), which can be …

    uiuc Repository record for Failures caused by supply fluctuations during system-level ESD (opens in a new tab)

  8. Design of Novel Devices and Circuits for Electrostatic Discharge Protection Applications in Advanced Semiconductor Technologies

    … having very fast rising time, e.g., CDM and IEC 61000-4-2 pulses. On this occasion a large overshoot voltage is generated and cause damage to internal circuit component like gate oxides of MOS devices. The key determination of turn-on speed of SCR is physically investigated, followed by a …

    ucf

  9. Design, Characterization and Analysis of Component Level Electrostatic Discharge (ESD) Protection Solutions

    … International Electrotechnical Commission (IEC) 61000-4-2 has been used for the product and the Human Metal Model (HMM) has been used for the system at the wafer level. Increasingly stringent design specifications are forcing original equipment manufacturers (OEMs) to minimize the number of …

    ucf