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Showing 1 to 5 of 5 for “"High-temperature packaging"”.
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Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
This thesis examines the packaging of high-temperature SiC power electronic devices. Current-voltage measurements were conducted on as-received and packaged SiC power devices. The planar structure was introduced and developed as a substitution for traditional wire-bonding vertical structure. The …
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Design and Development of High Density High Temperature Power Module with Cooling System
… that pushes the limitations of junction temperature, power rating, and switching frequency of Si devices. These advanced properties will lead converters to higher power density. However, the reliability of the SiC semiconductor is still under investigation, and at the same time, the …
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MESOSCALE MICROSTRUCTURE EVOLUTION, RELIABILITY AND FAILURE ANALYSIS OF HIGH TEMPERATURE TRANSIENT LIQUID PHASE SINTERING JOINTS
The continuous increase in application temperature of power electronic devices, due to the growing power density, miniaturization, and functionality in military and commercial applications, requires new packaging technologies with high temperature and reliability capabilities. Currently, the …
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Electrical Integration of SiC Power Devices for High-Power-Density Applications
… applications has led to the fast development of high-power-density power electronics converters. High-switching-frequency and high-temperature operations are the two key factors towards this target. Both requirements, however, are challenging the fundamental limit of silicon (Si) based devices. …
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Thermal Stability of Al₂O₃/Silicone Composites as High-Temperature Encapsulants
… which potentially operate above a junction temperature of 250°C, results in growing research interest in high-density and high-temperature packaging. There are high-temperature materials such as encapsulants on the market that are claimed for capability of continuous operation at or above …