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Showing 1 to 12 of 12 for “"High Temperature Electronics"”.
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Development of Cu particle sintering as die attach solution for high temperature electronics applications
… Cu Particle Sintering as Die Attach Solution for High Temperature Electronics Applications”, submitted to TU Berlin, investigates innovative copper (Cu) sintering techniques for die-attach applications in high-temperature electronics, particularly for wide bandgap semiconductors like silicon …
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Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
… die-attach material and substrate technology for high-temperature applications. For the die-attach material, a low-temperature sintering technique enabled by a nanoscale silver paste was developed for attaching large-area (>100 mm2) semiconductor chips. The nanoscale silver paste can be sintered …
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Silicon-Germanium Heterojunction Bipolar Transistors for High-Temperature and Radiation-Rich Environments
… pose unique challenges to all types of electronics. These extreme environments can cover a variety of different conditions, including, but not limited to, low temperatures, high temperatures, radiation, pressure etc. One technology that has shown promising robustness in extreme …
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p-GaN Platform for Next-Generation GaN Complementary Transistors and Circuits
… they offer compactness, reduced parasitics, and higher performance compared to discrete transistors or printed circuit board (PCB) integration. The p-GaN platform exhibits tremendous potential in power ICs and recently, in high temperature (500 °C) digital circuits. While the initial …
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System Design of a High-Temperature Downhole Transceiver
… spurring the need for extreme environment electronics. The oil and gas industry, in particular, is the oldest and largest market for high-temperature electronics, where the operating environment can extend up to 260 degrees Celsius. The electronics currently employed in this field are only …
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Memory Module Design for High-Temperature Applications in SiC CMOS Technology
… a significant and disruptive role in the power electronics industry. The same characteristics make this material a viable choice for high-temperature electronics systems. Leveraging the high-temperature capability of SiC is crucial to automotive, space exploration, aerospace, deep well drilling, …
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Electro-Thermal Device-Package Co-Design for a High-Temperature Ultra-Wide-Bandgap Gallium-Oxide Power Module
… that can operate in environments with ambient temperatures exceeding 250 °C are needed for innovation in automotive, aerospace, and down-hole applications. With the imminent mass electrification of transportation and industry, the high-temperature electronics market value is anticipated to grow …
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Modelling of the reliability of flip chip lead-free solder joints at high-temperature excursions
At high-temperature operations of electronic control devices, Tin-Silver-Copper (SnAgCu) alloy solder joints used to assemble the component of the devices are functioning at homologous temperature above 0.8. In such ambient temperatures, solder alloys have limited mechanical strength and will be …
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Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints
… role in electronic products as the integrity of electronics packaging and assembly rests on the quality of these connections. The increasing demands for higher performance, lower cost, and miniaturisation in hand-held and consumer electronic products have led to the use of dense interconnections. …
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A High Temperature RF Front-End of a Transceiver for High Speed Downhole Communications
Electronics are normally designed to operate at temperatures less than 125 oC. For high temperature applications, the use of those normal electronics becomes challenging and sometimes impractical. Conventionally, many industries tried to push the maximum operating temperature of electronics by …
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The Development and Packaging of a High-Density, Three-Phase, Silicon Carbide (SiC) Motor Drive
<p>Technology advances within the power electronics field are resulting in systems characterized by higher operating efficiencies, reduced footprint, minimal form factor, and decreasing mass. In particular, these attributes and characteristics are being inserted into numerous consumer applications, …
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High Temperature Silicon Carbide Mixed-signal Circuits for Integrated Control and Data Acquisition
… popularity as a substrate for power devices for high temperature and high voltage applications over the last two decades. Recent research has been focused on the design of integrated circuits for protection and control in these wide bandgap materials. The ICs developed in SiC and GaN can not only …