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Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 12 of 12 for “"High Power Electronics"”.
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Computational modeling of transport and growth-related processes of novel gallium-v materials for temperature-resilient and high-power electronics
… Ga-V materials for temperature-resilient and power electronics applications. These materials are based on mature and well-studied semiconductors, like GaAs and GaN, and there is untapped potential in utilizing unconventional elements, like Bi and Yb, to be used as alloy constituents. The …
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A piezoelectric translational flow agitator for active air cooling of electronics.
… micro-nano fabrication, the need increases for powerful cooling facilities. Different cooling schemes such as liquid cooling, direct sprays, boiling heat transfer, etc. have been developed to meet the needs of heat removal. Air cooling still has potential for improvement and continues to hold …
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Low Impurity Content GaN Prepared via OMVPE for Use in Power Electronic Devices: Connection Between Growth Rate, Ammonia Flow, and Impurity Incorporation
GaN has the potential to revolutionize the high power electronics industry, enabling high voltage applications and better power conversion efficiency due to its intrinsic material properties and newly available high purity bulk substrates. However, unintentional impurity incorporation needs to be …
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Exploring water-in-oil emulsions for immersion cooling: thermophysical properties, electrical insulation, and chip-level performance
… coolants for natural-convection cooling of high-power electronics. Conventional dielectric oils provide good insulation but low thermal conductivity, which limits chip-level heat dissipation. A property-based figure of merit for natural convection is derived to assess how density, heat …
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Pool Boiling of FC 770 on Graphene Oxide Coatings: A Study of Critical Heat Flux and Boiling Heat Transfer Enhancement Mechanisms
… a viable option for thermal management of high-power electronics by immersion cooling technology.
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Ion-beam processes in group-III nitrides
… diodes, and UV detectors) as well as devices for high-temperature/high-power electronics. In the fabrication of these devices, ion bombardment represents a very attractive technological tool. However, a successful application of ion implantation depends on an understanding of the effects of …
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Ion-beam processes in group-III nitrides
… diodes, and UV detectors) as well as devices for high-temperature/high-power electronics. In the fabrication of these devices, ion bombardment represents a very attractive technological tool. However, a successful application of ion implantation depends on an understanding of the effects of …
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Coupling electrolysis and surface patterning to improve onset of nucleate boiling and bubble departure in pool boiling heat transfer
… heater inside the copper block to supply power to the test chip, along with a series of vertically arranged thermocouples to accurately determine the heat flux and surface temperature. Using this setup, pool boiling was first measured for plain silicon, plain gold, and gold microstrip …
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Three-dimensional field-effect transistors with top-down and bottom-up nanowire-array channels
… to make arrays of NW channels (or fins) for high-power electronics. Bottom-up AlGaAs/GaAs heterostructure core-shell planar NWs are demonstrated on a wafer scale with excellent yield. Their placement is determined by lithographically patterning an array of Au seeds on semi-insulating GaAs …
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Oscillating heat pipes : study of their oscillating motion using neutron imaging and application
… heat pipes (OHP) are being studied as a higher performance way of cooling high power electronics. The oscillating motion of the liquid in an OHP has a significant role in the performance. However, the fluid dynamics in an OHP are very chaotic and they are not fully understood. In these …
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Design and performance characterization of high power density air-cooled compact condenser heat exchangers
… condenser heat exchangers with exceptional power density performance in excess of 100 W/cm3. This exceptional heat exchanger performance is attributed to the implementation of high-speed compressible air flow in circular microchannels and two-phase condensation flow of refrigerant in …
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Uv-liga Compatible Electroformed Nano-structured Materials For Micro Mechanical Systems
… process. Various micro mechanical systems with high-aspect-ratio and thick metallic structures have been developed and are presented in this desertation. A novel micro mechanical valve has been developed with nano-structured nickel realized with UV-LIGA fabrication technique. Robust compact …