Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 20 of 49 for “"Heterogeneous Integration"”.
-
PCB-Based Heterogeneous Integration of LLC Converters
Rapid expansion of the information technology (IT) sector, market size and consumer interest for off-line power supply continue to rise, particularly for computers, flat-panel TVs, servers, telecom, and datacenter applications. Normal components of an off-line power supply include an …
-
PCB-Based Heterogeneous Integration of PFC/Inverter
… a significantly higher operating frequency, the integration of inductors with embedded windings in the printed circuit board (PCB) is feasible. However, a PCB winding-based inductor has a fundamental limitation in terms of its power handling capability. The winding loss is proportional to the …
-
Low temperature heterogeneous integration of germanium on silicon
… infrared (mid-LWIR) range, and its ease of integration on a Si backbone make it a perfect candidate for photodetectors (PDs) for Telecom optical interconnects and waveguides for mid-LWIR optical sensors. However, optical interconnects are still larger than electrical interconnects, …
-
Three-Dimensional Heterogeneous Integration for RF/Microwave Applications
… baseband digital processing. In such systems, heterogeneous vertical integration, in which circuits in different technologies can be stacked on top of each other within the system architecture, can reduce the overall system size and power consumption. Chip stacking also enables …
-
Heterogeneous integration of optical wireless communications within next generation networks
… envisioned as supplementary access points within heterogeneous RF/OW networks. These networks opportunistically offload traffic to optical cells while utilizing the RF cell for highly mobile devices and devices that lack a reliable OW connection. Visible light communication (VLC) is considered as …
-
Heterogeneous integration of graphene and Si CMOS for gas sensing applications
… NO₂ and NH₃ gas molecules is investigated. This integration helps benefit the high gas sensitivity of graphene at room temperature as well as the compact size, robustness, low cost, and advantages of standard industrial scale production of CMOS technology. Recent progress in large scale growth of …
-
Heterogeneous integration of two-dimensional materials for on-chip optical interconnects
… This offers a simple approach to construct heterogeneous photonic architectures, which is currently challenging for silicon-based photonics integrated with germanium and III-V semiconductors due to mismatched lattice constants and thermal properties. In addition, the entire family of 2D …
-
Heterogeneous Integration of Spin-Photon Interfaces with s Scalable CMOS Platform
… individually, like scalable high-yield heterogeneous integration between diamond nanostructure and foundry control chip, parallel control and measurement, tuning of quantum emitter emission wavelength as well as lifetime, and coherent light correlation with quantum emitters as a proof of …
-
DENSE 3D HETEROGENEOUS INTEGRATION USING SELECTIVE COBALT ALD DEPOSITION AND RECONSTITUTED TIERS
… up exciting new opportunities for future 3D IC heterogeneous integration.
-
A Silicate-Based Packaging Material for 3-D Heterogeneous Integration of Microsystems
3D heterogeneous integration (HI) and wafer-level packaging (WLP) represent the cutting edge of microelectronics design and fabrication. However, the current limitations of microelectronics packaging materials inhibit the widespread implementation of these processes, which presents an opportunity …
-
Multiphysics Design and Modeling for Advanced Packaging and Heterogeneous Integration of Power Delivery
… delivery for advanced electronic packaging and heterogeneous integration architectures. Embedded inductors, essential for efficient power delivery, must maintain high performance at elevated temperatures, minimizing Joule heating and inductance loss. Designing such components requires robust …
-
Resolving oxidation phenomena in layered semiconductors and scaled heterogeneous integration for low-power electronics
… / oxide heterostructures for future integration into resistive switching devices.
-
Heterogeneous integration and characterization of III-V materials on silicon for active and passive photonic device arrays
Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2023-12-01
-
Heterogeneous Integration of III-V Multijunction Solar Cells on Si Substrate: Cell Design and Modeling, Epitaxial Growth and Fabrication
… key contenders in the renewable energy sector. Integration of such high-efficiency III-V multijunction solar cells on significantly cheaper and large area Si substrate has the potential to address the future LCOE roadmaps by unifying the high-efficiency merits of III-V materials with low-cost …
-
Photonic integration of divacancy color centers in silicon carbide and heterogeneous integration of lithium niobate on III-V/Si substrates
Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2027-05-01
-
Design/System Technology Co-optimization of Gallium Nitride High Electron Mobility Transistors for Next-G 3DIC Heterogeneous Integration of Gallium Nitride and Si CMOS
… GaN transistors with engineered linearity, novel heterogeneous integration with state-of-the-art Silicon (Si) bias and control circuitry, and advanced physics-based modeling. This thesis presents the development of a 3DIC consisting of GaN HEMTs and Si CMOS BEOL, in particular W-band GaN HEMTs, Si …
-
Design and fabrication of multimaterial electrohydrodynamic-jet deposition system
… printing. This thesis discusses the design, integration and operation of a unique E-jet printing platform. The uniqueness lies in the ability to utilize multiple materials in the same overall print-head thereby enabling increased degrees of heterogeneous integration of different …
-
Development of pick-and-place assembly techniques for monolithic optopill integration
The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess …
Page 1 of 3