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Showing 1 to 1 of 1 for “"Gold/tin soldering"”.

  1. Integration of ultrathin silicon chips

    … behavior of ultrahin silicon chips during gold/tin bump reflow and during flip chip soldering onto polyimide tapes was analyzed. The experiments and analyses are a contribution to the research area of flex systems based on solder connections between extremely thin chips and flexible …

    aachen Repository record for Integration of ultrathin silicon chips (opens in a new tab)