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Showing 1 to 1 of 1 for “"Glass packages"”.
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Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections
… and system scaling. In this regard, 3D glass system packages have emerged as a promising alternative due to their ultra-short system interconnection lengths, higher component densities and system reliability enabled by the tailorable coefficient of thermal expansion (CTE), high …